Integrated Circuit Package Channels for Die Hotspot Heat Dissipation
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Solution Overview
Problem
The challenge in the semiconductor industry is effectively dissipating heat generated by integrated circuit dies to improve performance and reliability, as traditional packaging techniques struggle to manage increasing heat densities with shrinking device sizes.
Innovation Solution
An integrated circuit package design featuring a lid with coolant fluid channels that directly dissipate heat from hotspots in the dies, utilizing channels in both the lid and the dies to enhance heat removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional packaging techniques are used, then device size can be reduced, but heat dissipation capability deteriorates
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat dissipation by extending coolant channels vertically through the lid structure and integrating them with vertical channels in the semiconductor die. This multi-layered, three-dimensional coolant channel architecture enables heat to be dissipated from multiple spatial dimensions simultaneously, effectively managing heat density in miniaturized devices without compromising cooling performance
2Quantity of substance
If integration density is increased, then more components fit in given area, but heat density increases making dissipation more difficult
Solution Approach 1:
The patent divides the heat dissipation system into multiple segmented coolant channels distributed throughout the lid and die structures. Rather than a single bulk cooling mechanism, the system employs numerous discrete, closely-spaced channels that segment the heat removal function across the entire device footprint, enabling effective heat dissipation from high-density integrated components
Solution Approach 2:
The patent implements localized heat dissipation by positioning coolant channels in specific regions corresponding to heat-generating components. The channel distribution and sizing are optimized for local heat flux requirements, with channels strategically placed near high-power devices to provide targeted cooling where heat density is highest
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively dissipates heat generated by integrated circuit dies, improving performance and reliability by ensuring efficient heat transfer through coolant fluid channels, thereby enhancing operational efficiency.
Implementation Method 1
heat generated in the one or more integrated circuit dies may be more effectively dissipated during the operation of the integrated circuit package, thereby improving the heat dissipation
Implementation Method 2
coolant fluid channels in the top portion and the bottom portions... coolant fluid may flow close to the hot-spots... heat generated in the one or more integrated circuit dies may be more effectively dissipated
Data Source
AI summary
An integrated circuit package and the method of forming the same are provided. An integrated circuit package may include a first die having a first substrate over a package substrate and a lid. A first channel may extend through the first substrate from a first sidewall of the first die to a second sidewall of the first die. The lid may include a top portion over the first die and a first bottom portion extending along the first sidewall of the first die. The first bottom portion may include a second channel connected to the first channel.