Die-to-Lid Soldered IC Assembly for Heat Dissipation and Swelling
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Solution Overview
Problem
Traditional thermal management configurations in integrated circuit assemblies are often large, expensive, and ineffective, or compromise structural characteristics such as rigidity and flexibility.
Innovation Solution
A semiconductor die is coupled with a lid via a solder bond layer and a thermally conductive coating, using materials with high thermal conductivity, and the lid may include perforations to allow controlled swelling, enhancing heat dissipation and structural balance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional thermal management configurations are used, then heat dissipation is achieved, but the assembly becomes large, expensive, and structurally compromised
Solution Approach 1:
The patent combines the thermal management function with the existing lid structure by coupling the lid directly to the semiconductor die through a solder bond layer. This integration eliminates the need for separate thermal management components, achieving effective heat dissipation while maintaining a compact assembly size.
Solution Approach 2:
The patent employs a composite structure consisting of the semiconductor die, solder bond layer, and lid coupled together. This composite assembly creates an integrated thermal management system that leverages the thermal conductivity of the lid materials while maintaining structural integrity and compact dimensions.
2Temperature
If traditional thermal management configurations are used, then heat dissipation is achieved, but manufacturing cost increases
Solution Approach 1:
By integrating the lid as both a structural and thermal management component, the patent eliminates the need for separate thermal management parts and their associated manufacturing steps. This consolidation reduces component count and assembly complexity, thereby lowering manufacturing costs while maintaining effective heat dissipation.
3Stability of the object's composition
If rigid coupling is used between die and lid, then structural stability is improved, but die swelling causes compression and operational issues
Solution Approach 1:
The patent modifies the coupling parameters by using a solder bond layer with specific material properties that balance structural stability and flexibility. The solder layer's mechanical properties are selected to accommodate die swelling during operation while maintaining adequate thermal contact and structural integrity, thus preventing compression-related operational issues.
4Reliability
If flexible coupling is used between die and lid, then die swelling is accommodated, but heat transfer efficiency decreases
Solution Approach 1:
The solder bond layer acts as a composite material that simultaneously provides mechanical compliance to accommodate die swelling and maintains sufficient thermal conductivity for effective heat transfer. The material composition and thickness are optimized to balance these competing requirements, ensuring both reliability and thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat transfer and structural integrity by allowing controlled swelling of the semiconductor die while maintaining effective heat dissipation and reducing compression, thus ensuring operational integrity and longevity of the integrated circuit assembly.
Implementation Method 1
a thermally conductive coating disposed on a surface of the semiconductor die
Implementation Method 2
a solder bond layer disposed on the copper coating
Data Source
AI summary
An integrated circuit assembly includes a semiconductor die, a copper coating disposed on a surface of the semiconductor die, a solder bond layer disposed on the copper coating, and a copper lid disposed on the solder bond layer.