Die Member Cleaning for Ceramic Honeycomb Molding
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Solution Overview
Problem
Existing methods for cleaning die members used in extrusion-molding of ceramic honeycomb structures are inefficient in removing binder-containing molding materials without damaging or deforming the die member, particularly for larger die members, and often result in incomplete cleaning or deformation due to high-pressure water spraying.
Innovation Solution
A method and apparatus that involves spraying a high-pressure fluid onto both sides of moldable-material-supplying holes and molding grooves, with adjustable pressures (8-15 MPa for holes and 1-5 MPa for grooves) to effectively remove the molding material without deforming the die member, utilizing a die-member-holding mechanism, high-pressure fluid nozzle, and nozzle-moving mechanism to ensure thorough cleaning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high-pressure water is sprayed to the holes to remove moldable ceramic material, then the material in holes is removed, but the material remaining in grooves cannot be completely removed
Solution Approach 1:
The cleaning process is divided into two distinct stages: first spraying high-pressure water to holes, then spraying to grooves. This segmentation allows each spraying action to target specific areas optimally, ensuring complete removal of moldable ceramic material from both holes and grooves without compromising cleaning efficiency
Solution Approach 2:
The holes are cleaned first as a preliminary action before cleaning the grooves. This preliminary cleaning of holes removes material that could interfere with subsequent groove cleaning, and prepares the system for the second spraying action to effectively remove material from grooves
2Reliability
If high-pressure water is sprayed to the grooves to remove moldable ceramic material, then the material in grooves is removed, but the pressure must be reduced to avoid deformation and damage
Solution Approach 1:
The cleaning process separates hole cleaning and groove cleaning into distinct stages with different pressure levels. High pressure is applied to holes where structural integrity allows, while lower pressure is used for grooves to prevent deformation, optimizing both cleaning effectiveness and component protection
Solution Approach 2:
Different pressure levels are applied to different parts of the die member: high pressure (8-15 MPa) for holes and lower pressure (1-5 MPa) for grooves. This local differentiation of cleaning parameters matches the structural characteristics of each area, ensuring effective cleaning without causing damage
3Productivity
If high pressure is used for spraying to grooves, then cleaning efficiency is improved, but deformation and damage of small grooves occurs
Solution Approach 1:
The cleaning system applies different pressure levels to different locations: high pressure (8-15 MPa) to holes and lower pressure (1-5 MPa) to grooves. This local quality approach ensures that each area receives the appropriate pressure level for its structural characteristics, maintaining groove dimensional accuracy while achieving effective cleaning
Solution Approach 2:
Holes are cleaned with high pressure first as a preliminary action, removing material that could interfere with groove cleaning. This allows subsequent groove cleaning to use lower pressure, preventing deformation while maintaining cleaning effectiveness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves high-efficiency removal of binder-containing molding materials from die members without deformation, ensuring the die member's integrity and maintaining the desired groove width, as demonstrated by successful cleaning of ceramic honeycomb structure die members with various ceramic materials and binders.
Implementation Method 1
spraying a high-pressure fluid onto both sides of moldable-material-supplying holes and molding grooves
Implementation Method 2
spraying a high-pressure fluid to the moldable-material-supplying holes, and then spraying a high-pressure fluid to the molding grooves
Data Source
Figure 1~2
Figure 3
Figure 4(a)~4(c)
AI summary
A method for cleaning a die member having molding grooves and moldable-ceramic-material-supplying holes communicating with the molding grooves, by removing a binder-containing moldable ceramic material from the die member after used for molding the moldable ceramic material, comprising the steps of spraying a high-pressure fluid to a surface of the die member on the side of moldable-material-supplying holes, and then spraying a high-pressure fluid to a surface of the die member on the side of molding grooves, thereby removing the moldable ceramic material.