Semiconductor Die Mesh Architecture for High-Bandwidth Core Integration
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Solution Overview
Problem
Next-generation data centers and compute devices face challenges in achieving increased bandwidth, power efficiency, and operational flexibility within a smaller physical footprint, as conventional solutions struggle to integrate evolving technologies and components effectively.
Innovation Solution
The implementation of an electrical mesh network that conductively couples semiconductor intellectual property cores (IP cores) to a base die with support circuitry, allowing for flexible integration of various IP cores with different technological advancements without requiring a full redesign of the semiconductor package, reducing physical separation and power losses, and enhancing communication speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If additional components are packed on a standard printed circuit board to address varied demands, then functionality increases, but chip-to-chip bandwidth is limited due to interconnect density
Solution Approach 1:
The patent transitions from two-dimensional PCB layout to three-dimensional stacked architecture, placing multiple semiconductor dies vertically above each other. This dimensional change enables high-bandwidth interconnects through short vertical pathways (TSVs) rather than long horizontal PCB traces, achieving both increased functionality and high chip-to-chip bandwidth simultaneously
2Adaptability or versatility
If additional components are packed on a standard printed circuit board, then functionality increases, but power demand increases due to long distance traces between chips
Solution Approach 1:
By stacking dies vertically and connecting them through short TSV pathways rather than long horizontal PCB traces, the patent dramatically reduces trace length and associated power losses. This enables increased functionality with lower overall power demand
3Adaptability or versatility
If additional components are packed on a standard printed circuit board, then functionality increases, but physical size increases
Solution Approach 1:
The patent stacks multiple functional dies vertically in a compact footprint, achieving high functionality within a small planar area. This three-dimensional integration dramatically reduces the physical size compared to two-dimensional PCB layouts
4Productivity
If monolithic integration is used to provide a potential solution, then integration density improves, but flexibility to integrate components evolving at different rates is lost
Solution Approach 1:
The patent divides the integrated system into separate semiconductor dies that can be independently designed, fabricated, and optimized for different technologies and process nodes. These segmented dies are then interconnected through TSVs to form a unified high-density package, achieving both integration density and technological flexibility
Solution Approach 2:
The patent creates a universal interconnect architecture (TSV-based mesh network) that can accommodate multiple types of semiconductor dies with different functions, technologies, and evolution rates. This universal platform enables flexible integration of diverse components while maintaining high integration density
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves bandwidth, reduces power consumption, and allows for the accommodation of rapid technological changes in IP cores, thereby addressing the limitations of traditional solutions by providing a scalable and efficient semiconductor package and die architecture.
Implementation Method 1
an electrical mesh network that conductively couples a plurality of semiconductor intellectual property cores to a base die
Data Source
AI summary
The present disclosure is directed to systems and methods of conductively coupling a plurality of relatively physically small core dies to a relatively physically larger base die using an electrical mesh network that is formed in whole or in part in, on, across, or about all or a portion of the base die. Electrical mesh networks beneficially permit the positioning of the cores in close proximity to support circuitry carried by the base die. The minimal separation between the core circuitry and the support circuitry advantageously improves communication bandwidth while reducing power consumption. Each of the cores may include functionally dedicated circuitry such as processor core circuitry, field programmable logic, memory, or graphics processing circuitry. The use of core dies beneficially and advantageously permits the use of a wide variety of cores, each having a common or similar interface to the electrical mesh network.