Semiconductor Die Micro-Trench Cooling for Multi-Die Heat Dissipation
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Solution Overview
Problem
As electronic products are miniaturized, heat dissipation in packaged dies becomes a critical issue, particularly in multi-die packages, where die arrangement affects data transmission speed and reliability.
Innovation Solution
The formation of micro-trenches on the rear surface of semiconductor dies within a package, which allows for efficient coolant flow through these trenches, enhancing heat dissipation without the need for thermal interface materials, and the use of a cooling cover that stacks over the package to facilitate this flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronic products are miniaturized, then product size is reduced, but heat dissipation becomes more difficult
Solution Approach 1:
The patent introduces micro-trenches that extend vertically through the die thickness, adding a third dimension (depth) to the heat dissipation pathway. This vertical channel structure allows coolant to flow through the die from top to bottom, providing heat dissipation in the depth dimension rather than only in the planar direction, thereby enabling effective cooling in miniaturized devices.
Solution Approach 2:
The patent introduces coolant as an intermediary substance that flows through the micro-trenches to transfer heat away from the die. The coolant acts as a thermal mediator between the heat-generating die and the external cooling system, enabling efficient heat removal without requiring larger device dimensions.
2Adaptability or versatility
If multi-die packages are used, then functionality is enhanced, but data transmission speed and reliability are affected
Solution Approach 1:
The patent applies different structural qualities to different regions of the die: the active surface region contains circuitry for functionality, while the rear surface region contains micro-trenches for heat dissipation. This local differentiation allows the die to simultaneously achieve high functionality on the front and effective cooling through the rear, supporting multi-die packages without compromising performance.
3Temperature
If thermal interface materials are used, then heat dissipation is facilitated, but device complexity increases
Solution Approach 1:
The patent extracts and eliminates the thermal interface material layer from the heat dissipation path by providing direct coolant contact with the die through micro-trenches. This removal of the intermediate thermal interface material simplifies the device structure and reduces thermal resistance, achieving better heat dissipation without the complexity of additional material layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively improves heat dissipation efficiency in semiconductor devices by allowing direct coolant contact with the package, thereby enhancing thermal exchange and maintaining data transmission speed and reliability.
Implementation Method 1
allows for efficient coolant flow through these trenches, enhancing heat dissipation
Implementation Method 2
enhancing thermal exchange
Data Source
AI summary
A semiconductor device includes a package and a cooling cover. The package includes a first die having an active surface and a rear surface opposite to the active surface. The rear surface has a cooling region and a peripheral region enclosing the cooling region. The first die includes micro-trenches located in the cooling region of the rear surface. The cooling cover is stacked on the first die. The cooling cover includes a fluid inlet port and a fluid outlet port located over the cooling region and communicated with the micro-trenches.