Die-Mounted Voltage Regulator Layout for Low-Loss 3D Packages
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Solution Overview
Problem
Traditional voltage regulators in electronic systems face parasitic losses due to long routing paths, and fully integrated voltage regulators increase costs and compete with other circuit functions, necessitating a more efficient power distribution solution.
Innovation Solution
A semiconductor package with die-mounted voltage regulators, where the regulators are integrated on the surface of IC dies within a 3D stack, using conductive paths like TSVs and metal traces to provide regulated voltages efficiently, minimizing parasitic losses and avoiding the need for expensive silicon die area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If board-level voltage regulators are used, then device complexity is reduced, but parasitic losses increase due to long routing paths
Solution Approach 1:
The voltage regulator is moved from the board level to the die level, transitioning to a different spatial dimension closer to the load. This dimensional change reduces the routing path length from board-level distances to millimeter-scale die-level distances, thereby reducing parasitic inductance and capacitive effects while maintaining manageable device complexity through modular integration.
2Loss of energy
If package-level voltage regulators are used, then parasitic losses are reduced, but package routing resources are consumed and impedance is introduced
Solution Approach 1:
The voltage regulator function is extracted from the package substrate and integrated directly onto the die surface. This extraction eliminates the need for package-level power distribution routing to the regulator, freeing up package routing resources and reducing the impedance introduced by substrate traces while maintaining reduced parasitic losses.
3Loss of energy
If fully integrated voltage regulators (FIVR) are used, then parasitic losses are minimized, but die area increases and circuit function competition occurs
Solution Approach 1:
The voltage regulator circuit is segmented and distributed across multiple dies rather than being fully integrated into a single die. This segmentation allows the regulator functionality to be achieved with minimal impact on any single die's active area, as the regulator components can be placed in unused or peripheral regions of the die surface, thus minimizing die area consumption while maintaining low parasitic losses.
Data Source
AI summary
A semiconductor package includes a package substrate having a first surface and an opposing second surface, and further includes an integrated circuit (IC) die disposed at the second surface and having a third surface facing the second surface and an opposing fourth surface. The IC die has a first region comprising one or more metal layers and circuit components for one or more functions of the IC die and a second region offset from the first region in a direction parallel with the third and fourth surfaces. The semiconductor package further includes a voltage regulator disposed at the fourth surface in the second region and having an input configured to receive a supply voltage and an output configured to provide a regulated voltage, and also includes a conductive path coupling the output of the voltage regulator to a voltage input of circuitry of the IC die.