Die Mounting System Cycle Time Optimization
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Solution Overview
Problem
The existing die mounting systems experience inefficiencies due to mismatched times in die transfer and mounting operations, leading to increased cycle times and reduced productivity, as the supply head and mounting head arrive at different positions at different times, resulting in waiting periods.
Innovation Solution
A die mounting system with a control system that optimizes the next die transfer position by calculating and minimizing the time difference between die transfer preparation and mounting operations, using a die transfer position determining program to adjust the supply head and mounting head movements, thereby synchronizing their arrival times and reducing cycle time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the supply head and mounting head operate independently with fixed sequences, then each head can complete its operations, but the cycle time increases due to waiting periods when one head arrives earlier than the other
Solution Approach 1:
The patent applies dynamics by making the die transfer position variable rather than fixed. The control system dynamically adjusts the die transfer position based on real-time comparison of operation times between the supply head and mounting head, allowing the system to adapt to different operational speeds and eliminate waiting periods
Solution Approach 2:
The patent changes the parameter of die transfer position to optimize cycle time. By calculating and comparing the time required for die transfer preparation operations versus die mounting operations, the system adjusts the die transfer position parameter to balance the arrival times of both heads, thereby minimizing or eliminating waiting time
2Productivity
If the die transfer position is fixed, then the operation sequence is simple, but the cycle time cannot be optimized and waiting time increases
Solution Approach 1:
The patent implements feedback by having the control system continuously monitor and compare the time required for die transfer preparation operations with the time required for die mounting operations. Based on this feedback, the system automatically adjusts the die transfer position to achieve optimal synchronization between the supply head and mounting head
Solution Approach 2:
The system performs self-optimization by automatically calculating and determining the optimal die transfer position without external intervention. The control system uses its own operational data to adjust parameters and minimize cycle time, making the system self-regulating
Data Source
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AI summary
In a die mounting system in which die supply device 12 is set on component mounter 11 and dies 22 supplied from die supply device 12 are mounted on circuit board 17 by mounting head 15 of component mounter 11, the next die transfer position is determined such that the longer of time Ta required for die transfer preparation operation (die 22 imaging and image processing, die pickup operation, and movement and vertical inverting operation of a supply head) of die supply device 12 and time Tb required for die mounting operation (movement and vertical motion at the mounting position of mounting head 15) of component mounter 11 is made shorter, and the difference (which corresponds to the waiting time at the die transfer position) between the two times decreased, such that the cycle time is shortened.