Integrated Die Mounting Structure for Electrical Isolation

The patent introduces a mounting structure comprising an insulating adhesive layer and a spacer as intermediary elements between the carrier and integrated device die. The insulating adhesive layer provides electrical isolation while bonding the components, and the spacer maintains physical separation to prevent wire bond contact with the die, thus resolving the electrical isolation issue while maintaining high integration density through stacking.

The mounting structure uses composite materials including insulating adhesive layer (such as epoxy-based materials) and spacer materials with specific dielectric properties. These composite materials provide both mechanical bonding functionality and electrical isolation properties simultaneously, enabling the stacked configuration to achieve both high integration density and reliable electrical isolation.

The patent employs materials for the mounting structure with closely matched thermal expansion coefficients to both the carrier and the integrated device die. This parameter matching reduces thermally-induced stress during temperature cycling and processing, allowing the stacked configuration to achieve high integration density without excessive stress on the carrier.

The insulating adhesive layer and spacer act as intermediary elements that distribute and reduce stress transmission between the carrier and the integrated device die. These compliant mounting structures absorb thermal expansion mismatches and mechanical stresses, protecting the carrier from stress-induced failures while enabling high-density stacking.

The spacer serves as an intermediary barrier that physically separates the wire bonds from the integrated device die. This spatial separation prevents direct contact between conductive wire bonds and the die, eliminating the shorting risk while maintaining electrical connection functionality through proper wire bond routing around or above the spacer.

The spacer introduces a vertical dimension of separation, lifting the wire bonds away from the die surface in the Z-direction. This dimensional separation provides electrical isolation in the vertical space while allowing horizontal wire bond routing to maintain electrical connections, thus resolving the shorting risk without compromising electrical connectivity.