Die Package Clip Contact Deformation for Complete Electroplating

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Solution Overview

Problem

Incomplete plating of clips in semiconductor packages due to insufficient electrical contact between the leadframe and clip during the electroplating process, leading to rejection of the die packages.

Innovation Solution

A method involving deformation of the clip contact section of the leadframe and/or the leadframe contact section of the clip to form a fixed electrically conductive contact, ensuring consistent current flow during plating.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the clip and leadframe are attached without deformation during plating, then the manufacturing process is simple, but incomplete plating occurs due to insufficient electrical contact

Engineering Contradiction:

Improveplating completenessVSAvoidprocess complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The contact sections of the leadframe and clip are deformed before the plating process to establish reliable electrical contact. This preliminary deformation ensures that when plating occurs, sufficient current flows from the leadframe through the contact sections to the clip, preventing incomplete plating while maintaining a relatively simple overall manufacturing process

Inventive Principle:

Principle #10Preliminary action

2Reliability

If the clip and leadframe are deformed to form fixed contact, then electrical contact reliability is improved, but additional manufacturing steps are required

Engineering Contradiction:

Improveelectrical contact reliabilityVSAvoidmanufacturing efficiency

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The deformation process that creates fixed electrical contact between the leadframe and clip is combined with the existing attachment process. By integrating the deformation step into the manufacturing flow, the patent achieves reliable electrical contact without adding significant complexity or reducing productivity, as the deformation occurs during the same operational sequence as the attachment

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Eliminates incomplete plating on leads, reducing the need for rejecting die packages and minimizing plating bath changes and equipment downtime.

Implementation Method 1

deforming the clip contact section of the leadframe and/or the leadframe contact section of the clip to form a fixed electrically conductive contact between the leadframe and the clip

Methodology Applied

Scientific EffectDeformation: Deformation

Implementation Method 2

The electroplating current will flow from the leadframe to the clip causing a reaction with the plating solution and the clip to be plated as well

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 3

A plating process typically involves immersing a die, leadframe and clip assembly in a plating solution and applying a current to the leadframe. The electroplating current will flow from the leadframe to the clip causing a reaction with the plating solution and the clip to be plated as well

Methodology Applied

Scientific EffectElectroplating: Electroplating

Data Source

PatentUS20250391747A1Method of forming a die package and die package arrangement

Publication Date: 2025.12.25 INFINEON TECHNOLOGIES AG

AI summary

A method of forming a die package is provided. The method includes attaching a die to a leadframe, attaching a clip to the die, wherein the clip includes a leadframe contact section that is arranged adjacent to a corresponding clip contact section of the leadframe, and deforming the clip contact section of the leadframe and/or the leadframe contact section of the clip to form a fixed electrically conductive contact between the leadframe and the clip.