Semiconductor Die Package Structure for Simpler Reliable Encapsulation

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Solution Overview

Problem

Existing electronic component manufacturing processes are complex and costly, with a need to reduce processing complexity while maintaining high device reliability.

Innovation Solution

The manufacturing of electronic components with a semiconductor die comprising a low ohmic first portion and a high ohmic second portion, where the first portion has an active area and the second portion is arranged on a mold layer or dielectric layer, simplifying the manufacturing process and reducing dimensions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional manufacturing processes are used, then device reliability is maintained, but processing complexity and manufacturing cost increase

Engineering Contradiction:

Improveprocessing complexityVSAvoiddevice reliability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The semiconductor die is segmented into two distinct portions: a low ohmic first portion containing the active area and a high ohmic second portion. This segmentation allows each portion to be optimized for its specific function, simplifying the overall manufacturing process while maintaining device reliability through specialized design.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different ohmic properties are applied to different portions of the semiconductor die. The first portion has low ohmic characteristics suitable for active circuit areas, while the second portion has high ohmic characteristics suitable for support and isolation functions. This local quality differentiation simplifies manufacturing by allowing standard processes to be applied to each region according to its specific requirements.

Inventive Principle:

Principle #3Local quality

2Volume of moving object

If the semiconductor die is made thin to reduce dimensions, then compactness is improved, but mechanical strength and handling difficulty worsen

Engineering Contradiction:

Improvecomponent dimensionsVSAvoidmechanical strength

Core Design Contradiction:

Volume of moving objectVSStrength

Solution Approach 1:

The semiconductor die combines two materials with different ohmic properties in a composite structure. The high ohmic second portion provides mechanical strength and support, allowing the overall die to be made thin for compactness while maintaining sufficient strength for handling. The composite structure leverages the strengths of each material region.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The high ohmic second portion acts as an intermediary between the thin, fragile active area and the external environment. It provides mechanical support and isolation, enabling the active area to be made very thin for compactness while the supporting portion maintains structural integrity during handling and assembly.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Strength

If a complex support structure is used, then mechanical strength is improved, but manufacturing effort and device complexity increase

Engineering Contradiction:

Improvesupport functionVSAvoidmanufacturing effort

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The high ohmic second portion of the semiconductor die serves multiple functions simultaneously: it provides mechanical support, electrical isolation, and structural integrity. By integrating these support functions into the die itself rather than requiring separate support structures, the invention reduces device complexity and manufacturing effort while maintaining the necessary strength.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The semiconductor die provides its own mechanical support and isolation functions through the high ohmic second portion, eliminating the need for external support structures. The die is self-sufficient, with the second portion serving the support function that would otherwise require additional components and manufacturing steps.

Inventive Principle:

Principle #25Self-service

4Ease of operation

If the active area is exposed for easy connection, then ease of operation is improved, but ohmic losses and high-frequency performance worsen

Engineering Contradiction:

Improveelectric connectionVSAvoidohmic losses

Core Design Contradiction:

Ease of operationVSLoss of energy

Solution Approach 1:

The semiconductor die applies different ohmic qualities to different regions: the low ohmic first portion minimizes energy losses in the active area, while the high ohmic second portion provides isolation. This local quality differentiation allows the active area to be optimized for low loss while maintaining ease of connection through proper design of the low ohmic region.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS20250029884A1Method of Manufacturing a Package Having an Electronic Component and an Encapsulant Encapsulating a Dielectric Layer and a Semiconductor Die of the Electronic Component

Publication Date: 2025.01.23 INFINEON TECHNOLOGIES AG

AI summary

A method of manufacturing a package that includes providing an electronic component that includes a dielectric layer as a base and a semiconductor die attached on top of the dielectric layer. The semiconductor die having an active area with monolithically integrated circuit elements. Encapsulating the dielectric layer and the semiconductor die by an encapsulant. The encapsulant is a mold compound having different material properties than the dielectric layer, and the dielectric layer includes a polymer.