Die Package With Integrated Die-To-Wire Connectors
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Solution Overview
Problem
Conventional integrated device assemblies face challenges with space efficiency, signal degradation due to long signal paths, increased cost, and weight due to the use of connectors on printed circuit boards (PCBs), which limit the miniaturization and performance of integrated circuits in die packages.
Innovation Solution
The integration of die-to-wire connectors directly on the die package reduces the distance signals need to travel, eliminates the need for separate connectors on the PCB, and simplifies the design by embedding connectors within the die package, thereby reducing space usage, signal degradation, and overall assembly weight and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connectors are placed on the PCB to connect die packages, then electrical connection is achieved, but the assembly occupies excessive space and increases weight
Solution Approach 1:
The patent merges the connector functionality directly into the die package structure. The wire-to-die connector integrates the electrical connection function with the die package body, eliminating the need for separate connectors on the PCB. This consolidation reduces the total assembly footprint while maintaining reliable electrical connections between the die package and PCB.
2Reliability
If connectors are placed on the PCB to connect die packages, then electrical connection is achieved, but the signal path length increases causing signal degradation
Solution Approach 1:
The patent extracts the connector from the PCB and relocates it directly to the die package structure. This repositioning shortens the signal path by eliminating unnecessary intermediate connection points and reducing the distance between the die package and PCB connection points, thereby minimizing signal degradation.
3Reliability
If connectors are placed on the PCB to connect die packages, then electrical connection is achieved, but the assembly cost and weight increase
Solution Approach 1:
The patent combines the connector functionality with the die package structure, eliminating the need for separate connector components on the PCB. This integration reduces the total component count, assembly weight, and manufacturing cost while maintaining reliable electrical connections.
4Reliability
If connectors are placed on the PCB to connect die packages, then electrical connection is achieved, but the device complexity increases
Solution Approach 1:
The patent extracts the connector from the PCB assembly and integrates it directly into the die package structure. This simplifies the overall assembly architecture by reducing the number of discrete components and interconnection points, thereby lowering device complexity while maintaining electrical connection reliability.
Data Source
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AI summary
Some novel features pertain to an integrated device package (e.g., die package) that includes a package substrate, a die, an encapsulation layer and a first set of metal layers. The package substrate includes a first surface and a second surface. The die is coupled to the first surface of the package substrate. The encapsulation layer encapsulates the die. The first set of metal layers is coupled to a first exterior surface of the encapsulation layer. In some implementations, the first set of metal layers is configured to operate as a die-to-wire connector of the integrated device package. In some implementations, the integrated device package includes a second set of metal layers coupled to the second surface of the package substrate. In some implementations, the integrated device package includes a second set of metal layers coupled to a second exterior surface of the encapsulation layer.