Die Package Structure with Molding Protrusions for Wire Bonding
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Solution Overview
Problem
Conventional die package structures require a spacer to create space for wire bonding, increasing the complexity and component count of the packaging process.
Innovation Solution
A die package structure utilizing a molding compound with protrusions to replace the conventional spacer, allowing for reduced packaging steps and components by forming a space for wire bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a spacer is used to create space for wire bonding, then wire bonding space is ensured, but the number of components and packaging complexity increase
Solution Approach 1:
The patent merges the spacer function with the molding compound by integrating protrusions directly into the molding compound structure. This eliminates the need for a separate spacer component while maintaining the wire bonding space function, thereby reducing packaging complexity while ensuring adequate space for wire bonding operations.
Solution Approach 2:
The patent extracts the spacer component from the packaging structure and replaces it with integrated protrusions in the molding compound. This removal of the separate spacer component reduces the number of parts and simplifies the packaging process while maintaining the necessary space creation function for wire bonding.
2Ease of operation
If a spacer is used to create space for wire bonding, then wire bonding space is ensured, but the number of packaging steps increases
Solution Approach 1:
The spacer function is merged into the molding compound through integrated protrusions, reducing the number of discrete packaging steps. The protrusions are formed during the molding process itself, eliminating separate spacer installation steps and improving overall packaging process efficiency while ensuring wire bonding space.
Solution Approach 2:
The protrusions are pre-formed during the molding compound fabrication process, creating the wire bonding space in advance. This preliminary action eliminates the need for subsequent spacer installation steps, streamlining the packaging process and improving productivity.
3Ease of operation
If a spacer is used to create space for wire bonding, then wire bonding space is ensured, but the component count increases
Solution Approach 1:
The spacer functionality is merged into the molding compound by forming protrusions as an integral part of the molding compound structure. This eliminates the need for a separate spacer component, reducing the component count while maintaining adequate space for wire bonding operations.
Solution Approach 2:
The molding compound serves multiple functions: it provides structural support, electrical insulation, and creates wire bonding space through its integrated protrusions. This multi-functionality eliminates the need for separate dedicated spacer components, reducing the overall component count in the packaging structure.
Data Source
AI summary
The present invention relates to a die package structure. The package structure comprises a first substrate, a first die, a sub-package and a first molding compound. The first die is disposed on the first substrate. The sub-package comprises a second substrate, a second die and a second molding compound. The second die is disposed on the second substrate. The second molding compound encapsulates the second die. The second molding compound has at least one protrusion, and the protrusion contacts with the first die. The first molding compound encapsulates the first die and the sub-package. Whereby, by utilizing the second molding compound that has the protrusion to replace the spacer in the stacked package, the packaging process can be shortened, and the components of the package can be reduced.