Die-Package Retaining Structure for Thermal Stress Relief

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Solution Overview

Problem

Conventional circuit-protected components face damage from thermal stressing during high-voltage current flow, and risk of solder liquefaction leading to short circuits upon cooling.

Innovation Solution

A die-packaging component with a retaining structure for the package body, featuring a substrate with a solder-collecting groove, a jumper structure with thermal deformation tolerance, and a package-body retaining structure that constrains the package body and allows the jumper arm to move along a thermal-deformation route, preventing relative movement and solder short circuits.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If the lead structure has low thermal capacity, then the lead can respond quickly to voltage changes, but the lead temperature rises severely causing thermal expansion and thermal stress

Engineering Contradiction:

Improveresponse speed to voltage changesVSAvoidlead temperature

Core Design Contradiction:

SpeedVSTemperature

Solution Approach 1:

The jumper structure acts as a thermal intermediary between the die and the lead. It has higher thermal capacity than the lead, absorbing excess heat and reducing thermal stress transmission to the die while still allowing electrical current flow.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The jumper structure is designed with specific thermal parameters (higher thermal capacity than the lead) to change the thermal response characteristics of the circuit path, reducing temperature rise during high-voltage transients.

Inventive Principle:

Principle #35Parameter changes

2Strength

If the package body is firmly retained by the oblique sidewall, then the package body is structurally supported, but thermal stress in parallel direction cannot be fully relieved

Engineering Contradiction:

Improvestructural support of package bodyVSAvoidthermal stress on die

Core Design Contradiction:

StrengthVSStress or pressure

Solution Approach 1:

The jumper structure is designed to be movable relative to the lead groove, allowing dynamic adjustment during thermal expansion. The lead groove defines a thermal-deformation tolerance allowable route that permits controlled movement to relieve thermal stress while maintaining structural integrity.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The retainer structure parameters (gap dimensions, groove geometry) are designed to allow specific ranges of thermal deformation, changing from a rigid fixed-position design to a controlled-movement design that accommodates thermal expansion.

Inventive Principle:

Principle #35Parameter changes

3Ease of manufacture

If the solder temperature rises abruptly to melt the solder, then the solder can flow to fill connections, but the cooled component may suffer from circuit shorting

Engineering Contradiction:

Improvesolder flow and connection formationVSAvoidcircuit shorting risk

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The jumper structure serves as a thermal buffer that absorbs and distributes heat during soldering, preventing localized overheating that could cause solder to bridge connections. It mediates between the heat source and the solder joints.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The jumper structure is positioned beforehand to provide thermal cushioning during the soldering process, preventing excessive heat concentration that could cause solder to become too fluid and create short circuits.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively prevents thermal damage to the die and avoids solder short circuits by retaining the package body and allowing the jumper arm to displace, ensuring the die is protected from thermal stressing and solder liquefaction.

Implementation Method 1

The jumper structure welded to the die generates a thermal deformation while in conducting a high-voltage current. While in meeting the thermal deformation, the jumper structure welded to the lead groove as well is movable along the thermal-deformation tolerance allowable route

Methodology Applied

Scientific EffectElastic deformation: Elasticity

Implementation Method 2

the lead PA13 and the package body PA14 would be expanded thermally, and thereby would induce thermal stressing to the die PA12

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS10037964B1Die-packaging component with retaining structure for package body thereof

Publication Date: 2018.07.31 TAIWAN SEMICONDUCTOR CO LTD

AI summary

A die-packaging component includes a substrate, a die, a jumper structure, a lead structure and a package body. The substrate has a base surface further including a die-connecting portion and a package-body retaining structure surrounding the die-connecting portion. The die connects the die-connecting portion. The jumper structure welded to the die generates a thermal deformation while in conducting a high-voltage current. The lead structure includes a lead groove defining a thermal-deformation tolerance allowable route. While in meeting the thermal deformation, the jumper structure welded to the lead groove as well is movable along the thermal-deformation tolerance allowable route. The package body at least partly covers the lead structure and the substrate, completely covers the die and the jumper structure, and is constrained by the package-body retaining structure.