Die Package Thermal Path Structure for 3D SIP Hotspots
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current 3D System in Package (SIP) structures face challenges with poor heat dissipation due to high thermal resistance, which limits the effective management of heat generated by densely packed devices, particularly in high-power electronic products like 5G mobile phones and wearable devices.
Innovation Solution
A die package structure is designed with a heat dissipation connection point and a heat conduction channel on the package substrate, coupled with a heat conduction structure that extends to the surface of the package body, allowing targeted heat dissipation from hotspots, using materials with low thermal resistance and potentially a protective metal coating for enhanced heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If devices are densely packed in a 3D SIP structure to improve layout density and miniaturization, then device layout density is increased, but thermal resistance increases and heat dissipation performance deteriorates
Solution Approach 1:
The heat dissipation connection point is segmented from the conventional unified heat dissipation approach, allowing targeted heat dissipation for specific hotspot regions. The heat conduction channel is formed as a separate, dedicated pathway within the package substrate, independent of the general package structure, enabling focused thermal management for densely packed devices
Solution Approach 2:
A heat conduction channel acts as an intermediary element between the hotspot on the die and the heat dissipation connection point on the package substrate. This intermediate structure provides a low thermal resistance pathway that bridges the thermal gap created by dense device packaging, effectively transferring heat from concentrated sources to dissipation points
2Reliability
If a heat conduction channel is formed in the package substrate to improve targeted heat dissipation, then heat dissipation efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The heat conduction channel is formed in the package substrate before the die is mounted and before final package assembly. This preliminary formation of the thermal pathway allows subsequent assembly steps to proceed without additional complex processing, as the heat dissipation infrastructure is already in place to receive and conduct heat from whatever die is ultimately mounted
Solution Approach 2:
The heat conduction channel serves multiple functions: it provides structural support within the package substrate, establishes electrical connectivity pathways, and simultaneously functions as a thermal conduction pathway. This multi-functionality reduces the need for separate dedicated heat dissipation structures, thereby limiting the increase in manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly improves heat dissipation efficiency by providing a lower thermal resistance path for heat conduction, effectively managing heat from hotspots in densely packed electronic devices, thereby addressing the limitations of existing SIP structures.
Implementation Method 1
a heat conduction channel that communicates the heat dissipation connection point with the hotspot is formed in the package substrate
Implementation Method 2
a heat conduction structure is formed in the first package body, and the heat conduction structure extends from the heat dissipation connection point to a surface of the first package body
Data Source
AI summary
This application provides a die package structure including a package substrate, a die, and a first package body. The package substrate has a first surface and a second surface opposite each other. The die is coupled to the package substrate, and the die has a hotspot. A heat dissipation connection point is disposed on the first surface of the package substrate, and a heat conduction channel that communicates the heat dissipation connection point with the hotspot is formed in the package substrate. A first connection terminal for connecting to an external device is disposed on the second surface. The first package body is disposed on the first surface, a heat conduction structure is formed in the first package body, and the heat conduction structure extends from the heat dissipation connection point to a surface of the first package body.