Die Package Backside Contact Structure for Lower-Cost Thermal Paths
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Solution Overview
Problem
Current die packages face challenges in achieving both low cost and optimal electrical and thermal performance due to high manufacturing costs and poor thermal performance, primarily due to the need for expensive laser micro-vias and plated through holes.
Innovation Solution
A simplified method for forming a die package that eliminates the need for expensive laser drilling by using plasma etching or water blasting to create openings, allowing direct connection of the die backside to the package top side, and utilizing a non-symmetric laminate structure with a metal structure made of the same material as the die contacts for improved thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If laser micro-vias and plated through holes are used to form electrical contacts, then electrical performance is improved, but manufacturing cost increases significantly
Solution Approach 1:
The patent extracts and eliminates the expensive laser drilling and plating processes from the manufacturing flow. Instead of creating separate micro-vias and plated holes, the invention uses a single etching step to create through-holes that serve both electrical connection and structural functions, removing the need for subsequent plating operations and reducing manufacturing complexity
Solution Approach 2:
The through-holes created by etching serve multiple functions simultaneously: they provide electrical connections between layers, serve as pathways for conductive materials, and establish mechanical alignment. This multi-functionality replaces what previously required separate specialized processes for each function, reducing overall manufacturing cost
2Reliability
If multiple layers and plated micro-vias are used to connect die sides to outer layers, then electrical connectivity is improved, but thermal performance deteriorates
Solution Approach 1:
The patent employs composite material structures where conductive materials are combined with thermally conductive substrates. The through-holes are filled with conductive epoxy or metal materials that provide both electrical connectivity and enhanced thermal conduction paths, creating a composite structure that addresses both electrical and thermal requirements simultaneously
Solution Approach 2:
The invention introduces direct thermal conduction paths through the substrate thickness dimension by creating through-holes that extend from one surface to the other. This dimensional approach allows heat to conduct directly through the package structure rather than being forced to travel through multiple lateral interconnection layers, significantly improving thermal performance
3Reliability
If the die back side is connected via plated micro-vias, then electrical connection is achieved, but direct exposure to package top side is lost
Solution Approach 1:
Instead of connecting the die back side through conventional plated micro-vias that require complex multi-layer routing, the patent inverts the approach by creating through-holes that directly penetrate the substrate from the top side to the bottom side. This allows the die back contacts to be directly connected to external pads on the opposite surface, simplifying the interconnection architecture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs and enhances thermal performance by minimizing thermal resistance while maintaining electrical integrity, resulting in a cost-effective and high-performance die package.
Implementation Method 1
a metal structure substantially directly contacting the entire surface of the second die contact of the die... enhanced thermal performance by minimizing thermal resistance
Implementation Method 2
the insulating material electrically insulates the metal structure from the first die contact
Data Source
AI summary
A die package and method is disclosed. In one example, the die package includes a die having a first die contact on a first side and a second die contact on a second side opposite the first side, and insulating material laterally adjacent to the die. A metal structure substantially directly contacts the surface of the second die contact, wherein the metal structure is made of the same material as the second die contact. A first pad contact on the first side of the die electrically contacts the first die contact, and a second pad contact on the first side of the die electrically contacts the second die contact via the metal structure. The insulating material electrically insulates the metal structure from the first die contact.