Semiconductor Die Pad Alignment Jig for Bonding Reliability
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Solution Overview
Problem
In semiconductor device manufacturing, the variability in bending accuracy of lead frames can lead to inclined die pads, resulting in reduced bonding strength between conductive members and semiconductor chips, particularly due to reverse inclination which causes adhesive to flow towards the tip portion, making uniform adhesive supply difficult and affecting chip mounting reliability.
Innovation Solution
A semiconductor device manufacturing method using a jig with a first and second convex part to securely press against a die pad, ensuring the die pad is aligned and securely fixed on the stage, thereby eliminating inclination and enhancing bonding reliability by applying pressure to specific points on the die pad's surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a lead frame with bent suspension lead is used to support the die pad, then the die pad can be positioned on the stage, but the bending accuracy varies causing the die pad to become inclined
Solution Approach 1:
The jig is designed with convex parts that preliminarily contact and press the die pad at specific positions before the bonding process, pre-correcting the inclination caused by bending variations in the suspension lead
Solution Approach 2:
The jig acts as an intermediary tool between the stage and the die pad, providing mechanical support and pressure to maintain proper die pad orientation during the bonding process
2Adaptability or versatility
If the die pad is inclined on the stage, then the lead frame structure can accommodate bending variations, but the bonding strength between conductive member and semiconductor chip decreases
Solution Approach 1:
The jig applies preliminary counter-pressure to the inclined die pad at specific contact points, preventing the inclination from affecting the bonding process. The convex parts of the jig are positioned to counteract the reverse inclination and ensure proper adhesive distribution
Solution Approach 2:
The jig applies localized pressure at specific convex parts on the die pad surface rather than uniform pressure, targeting the specific inclination areas to correct the orientation while maintaining overall bonding quality
3Stability of the object's composition
If reverse inclination occurs on the die pad, then the lead frame can still hold the chip, but adhesive flows towards the tip portion making uniform supply difficult
Solution Approach 1:
The jig applies preliminary counter-pressure at the convex parts to prevent adhesive from flowing towards the tip portion during the bonding process, ensuring uniform adhesive distribution across the chip mounting area
Data Source
AI summary
A semiconductor device manufacturing method which enhances the reliability of a semiconductor device. The method includes a step in which a source wire is connected with a semiconductor chip while jigs are pressed against a die pad. The jigs each have a first support portion with a first projection and a second support portion with a second projection. Using the jigs thus structured, the first projection is made to contact with a first point on the front surface of the die pad and then the second projection is made to contact with a second point on the front surface of the die pad located closer to a suspension lead than the first point.