Overlapping Die Pad Package Layout for High-Voltage Insulation
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Solution Overview
Problem
Semiconductor devices with multiple elements in a single package face challenges in maintaining insulation withstand voltage due to differences in power supply voltages between conduction paths, leading to potential electrical insulation failures.
Innovation Solution
The semiconductor device incorporates a conductive support member with separate die pads and an insulating element that relays signal transmission between semiconductor elements, using a sealing resin to ensure insulation and manage potential differences in power supply voltages, with specific geometrical features on the die pads to optimize electrical field distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple semiconductor elements are mounted in one package with different power supply voltages, then integration and functionality are improved, but insulation withstand voltage between conduction paths deteriorates
Solution Approach 1:
The support member is divided into multiple die pads (first die pad, second die pad, third die pad) that are electrically isolated from each other. Each die pad serves as a separate conduction path for different power supply voltages, preventing electrical interference while maintaining integration within a single package.
Solution Approach 2:
An insulating element is introduced as an intermediary between the first conduction path (first die pad) and the second conduction path (second die pad). This insulating element physically separates the conduction paths with different power supply voltages, ensuring electrical insulation while allowing both paths to coexist in the same package.
2Area of stationary object
If die pads are positioned close to each other for compact design, then device size is reduced, but electrical insulation between conduction paths deteriorates
Solution Approach 1:
The insulating element extends in the thickness direction (vertical dimension) between the first die pad and second die pad. By utilizing the vertical dimension for insulation rather than only horizontal separation, the design achieves both compact footprint and adequate electrical insulation distance.
Solution Approach 2:
The insulating element acts as a mediator that fills the space between closely positioned die pads, providing electrical insulation without requiring large horizontal separation distances. This allows compact packaging while maintaining insulation integrity.
3Area of stationary object
If overlapping die pads are used to reduce footprint, then area efficiency is improved, but electrical field distribution and insulation uniformity deteriorate
Solution Approach 1:
The insulating element provides localized electrical insulation specifically in the overlapping region where the first die pad and second die pad are positioned. This localized insulation ensures uniform electrical field distribution in the critical overlap area while allowing the overall package to maintain compact footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the insulation withstand voltage between circuits, effectively addressing the voltage differences and improving the reliability of semiconductor devices in applications like electric vehicles and hybrid vehicles.
Implementation Method 1
a sealing resin that covers the first die pad, the second die pad, the first semiconductor element, the second semiconductor element, and the insulating element and insulates the first die pad and the second die pad from each other
Implementation Method 2
an insulating element that conducts to the first semiconductor element and the second semiconductor element and insulates the first circuit and the second circuit from each other
Data Source
AI summary
A semiconductor device includes a conductive support member, a first semiconductor element, and a second semiconductor element. The conductive support member includes a first die pad and a second die pad separated from each other in a first direction. The first die pad and the second die pad overlap each other when viewed along the first direction. The first die pad has a first main surface mounting the first semiconductor element, and a first back surface opposing the first main surface. The second die pad has a second main surface mounting the second semiconductor element, and a second back surface opposing the second main surface. When viewed along a second direction, a distance in the first direction between the first back surface and the second back surface is larger than a distance in the first direction between the first main surface and the second main surface.