Die Pad Surface Texture to Prevent Resin Detachment Breakdown
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Solution Overview
Problem
Conventional semiconductor devices for inverter systems in electric vehicles face challenges with dielectric breakdown due to detachment of sealing resin, particularly under heat stress and at surface irregularities, which can lead to insulation failure and reduced device reliability.
Innovation Solution
The semiconductor device incorporates a conductive member with an uneven part on its surface, which is covered by a sealing resin, enhancing adhesion and preventing resin detachment by providing an anchor effect, thereby improving insulation integrity and reducing dielectric breakdown risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a flat surface is used for the conductive member, then the manufacturing process is simple, but the sealing resin detaches under heat stress causing dielectric breakdown
Solution Approach 1:
The conductive member surface is made non-uniform with protrusions and recesses, creating localized variations in surface topology. This local quality change increases the surface area and provides mechanical interlocking features for the sealing resin, preventing detachment under heat stress while maintaining overall device simplicity
Solution Approach 2:
The surface of the conductive member is modified with curved protrusions and recesses instead of a flat plane. These curved features increase the contact area with the sealing resin and create anchor points that resist detachment forces, improving reliability without significantly complicating the device structure
2Strength
If the sealing resin is applied on a smooth surface, then the application process is easy, but adhesion is insufficient leading to resin detachment
Solution Approach 1:
The conductive member surface features localized protrusions and recesses that create mechanical interlocking with the sealing resin. This local surface variation significantly enhances adhesion strength by providing physical anchors, while the resin application process remains straightforward as the features are integrated into the base structure
Solution Approach 2:
The interface between the conductive member and sealing resin forms a composite structure where the non-uniform surface topology acts as a mechanical reinforcement. This composite approach combines the conductive member with the resin in a way that maximizes interfacial bonding area and strength, improving adhesion without complicating manufacturing
3Temperature
If heat stress is applied to the device, then the operational capability is maintained, but dielectric breakdown occurs due to resin detachment
Solution Approach 1:
The non-uniform surface with protrusions and recesses creates localized mechanical anchors that resist the thermal expansion and contraction forces generated under heat stress. This local structural feature maintains the sealing resin's attachment integrity, preventing dielectric breakdown and ensuring continued operational capability at elevated temperatures
Solution Approach 2:
The protrusions and recesses on the conductive member surface act as pre-designed stress distribution features that cushion the thermal stresses before they can cause resin detachment. This beforehand structural preparation allows the device to withstand heat stress without compromising insulation performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses dielectric breakdown and enhances the reliability of semiconductor devices by improving the adhesion of the sealing resin to the conductive member, ensuring consistent insulation performance even under stress conditions.
Implementation Method 1
an uneven part on a surface of the conductive member, the uneven part covered by the sealing resin
Data Source
AI summary
A semiconductor device is configured to suppress an occurrence of dielectric breakdown in the semiconductor device. The semiconductor device includes an insulating element, a conductive member on which the insulating element is mounted, and a sealing resin covering the insulating element. The conductive member includes an uneven part covered by the sealing resin. As an example, in the semiconductor device, the conductive member includes a first die pad on which the insulating element is mounted, and the uneven part includes a first region that is provided on the first die pad.