Die Pad Ridge Structure for Semiconductor Resin Bleed Control
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Solution Overview
Problem
Semiconductor device packages face challenges with resin bleed contamination, leading to reduced reliability, performance, and increased costs due to contamination of manufacturing equipment and larger device sizes required by conventional design rules.
Innovation Solution
Incorporating ridges at the outer edges of the die pad in the package leadframe to control resin bleed, preventing it from reaching the backside of the die pad and contaminating manufacturing equipment, while maintaining the size of the die pad and package leadframe.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional design rules are used to prevent resin bleed contamination, then manufacturing equipment contamination is reduced, but the die pad size and package leadframe size must be enlarged
Solution Approach 1:
The die pad is segmented by adding ridges that divide the continuous surface into distinct regions. These ridges create barriers that segment the resin bleed path, preventing contamination from spreading across the entire die pad surface while maintaining a compact size.
Solution Approach 2:
Ridges are introduced as intermediary structures between the resin bleed source and the critical areas of the die pad. These ridges act as mediators that intercept and contain the resin bleed, preventing it from reaching contamination-sensitive zones without requiring an enlarged die pad.
2Object-affected harmful factors
If conventional design rules are used to prevent resin bleed contamination, then manufacturing equipment contamination is reduced, but the package leadframe size must be enlarged
Solution Approach 1:
The package leadframe structure is segmented by incorporating ridges on the die pad that create localized containment zones. This segmentation allows the resin bleed to be confined to specific regions, eliminating the need to enlarge the entire package leadframe volume for contamination prevention.
Solution Approach 2:
The solution moves from a two-dimensional approach (enlarging the die pad area) to a three-dimensional approach by adding vertical ridges. This dimensional change creates height-based barriers that contain resin bleed without increasing the horizontal footprint or overall package volume.
3Object-affected harmful factors
If ridges are added to control resin bleed, then resin bleed contamination is eliminated, but the die pad structure becomes more complex
Solution Approach 1:
Rather than making the entire die pad complex, the solution applies local quality by adding ridges only in specific strategic locations where resin bleed control is needed. The majority of the die pad structure remains simple and unchanged, minimizing overall structural complexity.
Solution Approach 2:
The complexity is managed by controlling the parameters of the ridges (height, width, spacing) within optimized ranges. By standardizing these parameters and using conventional manufacturing processes, the structural complexity remains manageable despite the added features.
4Object-affected harmful factors
If ridges are added to control resin bleed, then manufacturing equipment contamination is prevented, but the manufacturing process becomes more complex
Solution Approach 1:
The ridge formation process is merged with existing die pad manufacturing operations. By integrating the ridge creation into the established manufacturing workflow rather than adding a separate process step, the ease of manufacture is maintained while achieving resin bleed control.
Data Source
AI summary
A method of manufacturing a semiconductor device is provided. The method includes forming a package leadframe including a die pad, a first ridge formed at a first outer edge of the die pad, a second ridge formed at a second outer edge of the die pad opposite of the first outer edge and separate from the first ridge, and a plurality of leads surrounding the die pad. A semiconductor die is attached to the die pad by way of a die attach material. The semiconductor die is located on the die pad between the first ridge and the second ridge. An encapsulant encapsulates the semiconductor die and at least a portion of the package leadframe.