Die Pickup Load Monitoring for Breakage Detection During Mounting
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Solution Overview
Problem
Existing die mounting devices fail to accurately determine whether a die has broken when peeling it from a sheet to which a wafer divided into multiple dies is affixed, leading to potential damage and fragmentation issues.
Innovation Solution
A die mounting device equipped with a load measuring section and control system that determines die breakage by monitoring the load applied during peeling, controlling the peeling and picking processes to handle broken dies appropriately, and discarding or returning them to prevent fragmentation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the pusher pin pushes the die from underneath the sheet during peeling, then the die can be effectively separated from the sheet, but the die may break and create fragments
Solution Approach 1:
The patent replaces the conventional mechanical pusher pin system with an air blow system. Compressed air is directed through a nozzle onto the die from underneath the sheet, utilizing aerodynamic forces to separate the die from the sheet instead of mechanical contact. This substitution eliminates the direct mechanical pushing action that causes die breakage and fragment generation, while still achieving effective die separation.
2Measurement precision
If the load measuring section monitors load during peeling, then die breakage can be detected, but the device complexity increases
Solution Approach 1:
The patent introduces an air blow system as an intermediary between the sheet and the die. By directing compressed air onto the die from underneath, the system creates a controllable force application mechanism that allows for precise monitoring of die separation. The air pressure and flow can be regulated to achieve gentle yet effective separation, and the load measuring section can monitor the forces involved without requiring complex mechanical contact systems.
3Reliability
If the nozzle contacts the die during pickup, then the die can be securely held, but the die may be damaged
Solution Approach 1:
The patent employs pneumatic principles by using compressed air delivered through a nozzle to interact with the die. The air stream creates pressure and flow patterns that can securely hold or propel the die without requiring direct mechanical contact that might cause damage. The pneumatic system allows for controlled force application that adapts to the die's position and orientation, ensuring reliable pickup while preserving die integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables quick and accurate detection of die breakage, minimizing damage and preventing fragments from falling onto target objects by controlling the peeling and picking processes.
Implementation Method 1
a load measuring section configured to measure a load applied to the nozzle or the pusher pin
Implementation Method 2
configured to pick up a die from a sheet to which a wafer divided into multiple dies is affixed using a nozzle
Data Source
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AI summary
A component mounting device that uses suction nozzle 24 to pick up a die D that is a target for pickup from among dies D affixed to die sheet 63 while the die D is being pushed up from underneath die sheet 63 by pusher pin 73 and mount the die D on a target object. The component mounting device measures load F applied to suction nozzle 24 as the die D is being pushed up by the pusher pin in a state with the suction nozzle contacting the die, and determines that the die broke if the load F decreases rapidly (S140). The component mounting device, in a case in which the die breaks, lowers the pusher pin and the suction nozzle (S160, S170), and returns the broken die to its original position by supplying positive pressure to the suction nozzle (S180).