Semiconductor Die Pickup Cover Plate Sliding Mechanism
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Solution Overview
Problem
Existing methods for picking up semiconductor dies using push-up needles or vacuum suction methods often result in damage due to excessive force, especially for low-profile dies, as they require large suction holes or significant tensile forces, which can break or deform the dies.
Innovation Solution
A die pickup apparatus with a stage and cover plate mechanism that includes a suction opening and a collet for suctioning the semiconductor die, where the cover plate slides to create a gap and then opens to allow the dicing sheet to be suctioned away from the die, reducing the force exerted on the die and minimizing damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a push-up needle is used to pick up semiconductor dies, then the dies can be separated from the dicing sheet, but the pushing force can break thin low-profile semiconductor dies
Solution Approach 1:
The invention removes the push-up needle component entirely from the system. Instead of pushing the die from below, the system uses a cover plate that slides horizontally to separate the dicing sheet from the die, eliminating the harmful pushing force while achieving the same separation goal.
Solution Approach 2:
The invention replaces the mechanical push-up needle system with a vacuum-based suction system combined with a sliding cover plate. The vacuum suction holds the die without contact, while the cover plate provides the separation function, substituting harmful mechanical pushing with non-contact vacuum holding and controlled horizontal sliding.
2Reliability
If vacuum suction is used through large suction holes to remove the dicing sheet, then the sheet can be separated, but the large suction force can break or deform thin semiconductor dies
Solution Approach 1:
The invention divides the suction function into two distinct components: the collet provides vacuum suction to hold the die, while the cover plate provides horizontal sliding to separate the dicing sheet. This segmentation allows each component to perform its function with appropriate force levels, preventing excessive suction force from deforming the die.
Solution Approach 2:
The cover plate acts as an intermediary between the vacuum system and the dicing sheet. Instead of applying vacuum force directly to the die through large holes, the cover plate slides horizontally to separate the sheet, mediating the separation process to avoid excessive force on the die while still achieving complete sheet removal.
3Object-affected harmful factors
If the cover plate slides horizontally to separate the dicing sheet, then the separation force is reduced, but the cover plate structure increases device complexity
Solution Approach 1:
The invention merges the cover plate sliding mechanism with the existing vacuum suction system. The cover plate is integrated into the same apparatus that provides vacuum suction, combining two functions (holding the die via vacuum and separating the sheet via sliding) into a single unified device, thereby reducing overall system complexity despite adding the sliding feature.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates the safe and efficient picking up of semiconductor dies by controlling the force applied during separation, reducing the risk of damage and allowing for precise handling of low-profile dies.
Implementation Method 1
a collet that suctions the semiconductor die
Implementation Method 2
the dicing sheet is sequentially suctioned into the opened suction opening
Data Source
AI summary
A die pickup apparatus facilitates picking up a semiconductor die in a manner such that, in a state in which a semiconductor die to be picked up is suctioned by a collet, a frontal end of a cover plate is caused to extend from a contact surface, and the cover plate is caused to slide while pushing up a dicing sheet and the semiconductor die, and subsequently a rear end of the cover plate is caused to extend from the contact surface such that an upper surface of the cover plate is substantially in parallel with the contact surface, the cover plate is caused to slide while pushing the dicing sheet and the semiconductor die with the upper surface of the cover plate such that the suction opening is opened, and the dicing sheet is suctioned into the opened suction opening, thereby separating the dicing sheet.