Die Pickup Module Non-Contact Picker for TSV Contamination

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Solution Overview

Problem

The increasing integration of semiconductor devices leads to smaller pad pitches, resulting in contamination issues during the die bonding process, particularly in through silicon via (TSV) bonding, where electrode pads on the die's front surface are prone to contamination during pickup from the wafer.

Innovation Solution

A die pickup module with a non-contact picker using ultrasonic vibration and vacuum or Bernoulli chucks to pick up dies without contacting the front surface, preventing contamination by maintaining a non-contact state and inverting the die for secure bonding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional picker contacts the front surface of the die to pick it up, then the die can be securely gripped, but the front surface of the die becomes contaminated

Engineering Contradiction:

Improvegrip securityVSAvoidfront surface contamination

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces an intermediary mechanism (e.g., suction cup, magnetic field, or mechanical fingers that contact only the rear surface) between the picker and the die. This intermediary allows secure gripping without direct contact between the picker and the front surface of the die, thereby preventing contamination while maintaining grip security.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent inverts the pickup approach by contacting the rear surface of the die instead of the front surface. The picker is designed to approach from below and contact only the rear surface or the dicing tape supporting the die, reversing the conventional top-down pickup method that causes front surface contamination.

Inventive Principle:

Principle #13The other way round (Inversion)

2Adaptability or versatility

If the pad pitch on the die is reduced to increase integration, then more electrode pads can be arranged, but the risk of contamination and bonding failure increases

Engineering Contradiction:

Improveintegration degreeVSAvoidbonding reliability

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

By introducing an intermediary pickup mechanism that avoids contact with the front surface, the patent protects the electrode pads from contamination. This is particularly critical when pad pitch is reduced, as contaminated pads would lead to bonding failures in high-density configurations.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent applies preliminary protective action by preventing contamination before the bonding process occurs. The non-contact pickup method ensures that the front surface and electrode pads remain clean throughout the pickup and placement process, preemptively avoiding bonding failures that would otherwise occur with reduced pad pitch.

Inventive Principle:

Principle #9Preliminary anti-action

3Object-affected harmful factors

If a non-contact pickup method is used to prevent contamination, then the front surface remains clean, but the complexity of the pickup device increases

Engineering Contradiction:

Improvefront surface contaminationVSAvoidpicker structure

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent replaces direct mechanical contact pickup methods with non-contact mechanisms such as suction cups using vacuum pressure, magnetic fields, or acoustic fields. These substitutions eliminate the need for complex mechanical gripping structures that would otherwise be required to securely hold the die without contact, thereby reducing overall device complexity while maintaining contamination prevention.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Prevents contamination of the die's front surface during bonding, reducing the risk of bonding failures and electrical defects between electrode pads, ensuring reliable semiconductor device assembly.

Implementation Method 1

an ultrasonic vibration unit for maintaining the die in a non-contact state using ultrasonic vibration

Methodology Applied

Scientific EffectUltrasonic vibration: Ultrasonic Vibration

Implementation Method 2

a vacuum chuck for providing suction force to the die using a vacuum pressure so that the die is maintained in a non-contact state

Methodology Applied

Scientific EffectVacuum pressure: Vacuum

Implementation Method 3

a Bernoulli chuck for forming a flow of air on the die so as to maintain the die in a non-contact state and providing suction force to the die using negative pressure generated by the flow of air

Methodology Applied

Scientific EffectBernoulli effect: Bernoulli Effect

Data Source

PatentUS12090642B2Die pickup module and die bonding apparatus including the same

Publication Date: 2024.09.17 SAMSUNG ELECTRONICS CO LTD

AI summary

Provided are a die pickup module and a die bonding apparatus including the same. The die pickup module includes a wafer stage for supporting a wafer including dies attached on a dicing tape, a die ejector arranged under the dicing tape and for separating a die to be picked up from the dicing tape, a non-contact picker for picking up the die in a non-contact manner so as not to contact a front surface of the die, a vertical driving unit for moving the non-contact picker in a vertical direction to pick up the die and an inverting driving unit for inverting the non-contact picker to invert a die picked up by the non-contact picker.