Die Pickup Device Peeling Starting Point
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Solution Overview
Problem
The existing die peeling methods, such as those using thrusting pins and multi-stage blocks, struggle to securely peel thin dies due to stress concentration at the periphery or corners, leading to deformation and breakage, especially when a die attach film is involved, resulting in unstable peeling.
Innovation Solution
A pickup method and device that forms a peeling starting point by thrusting up the dicing film at a predetermined part of the die's circumference, using pins at the corners, and employing a dual-thrusting mechanism driven by a single source to reduce stress and facilitate secure peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the die is thinned to 20 μm or less to promote high density packaging, then the package thickness is reduced, but the rigidity of the die is extremely reduced making it prone to deformation and breakage during peeling
Solution Approach 1:
The patent creates a peeling starting point by thrusting up the dicing film at a predetermined part (corner or circumference) of the die before the main peeling action. This preliminary action initiates peeling at a controlled location, allowing the die to be peeled gradually from the corner/edge rather than being lifted uniformly, which prevents stress concentration and deformation of thin dies
Solution Approach 2:
The patent divides the peeling process into two distinct stages: first creating a peeling starting point at a specific location (corner or circumference), then proceeding with the main peeling action. This segmentation allows controlled stress distribution, preventing the die from deforming or breaking during the peeling process
2Ease of operation
If thrusting pins or multi-stage blocks are used to peel the die, then the peeling process can be executed, but stress concentrates at the periphery or corner of the die causing deformation and breakage
Solution Approach 1:
The patent uses the dicing film itself as an intermediary element to create the peeling starting point. By thrusting up the dicing film at a predetermined part, the peeling is initiated through the film rather than directly on the die, which distributes stress more evenly and prevents concentration at the die's periphery or corners
Solution Approach 2:
The patent applies the thrusting action locally at a predetermined part (corner or circumference) of the die rather than uniformly across the entire die surface. This localized approach creates a controlled peeling starting point that prevents stress concentration at multiple locations, thereby maintaining die integrity
3Strength
If a die attach film exists between the die and dicing tape, then adhesive strength between dicing tape and die attach film may be stronger, but the effect of anchoring increases making peeling unstable
Solution Approach 1:
The patent creates a peeling starting point by thrusting up the dicing film before the main peeling action. This preliminary action initiates peeling at a controlled location, allowing the die to be peeled gradually from the corner/edge rather than being lifted uniformly, which prevents stress concentration and deformation of thin dies
Solution Approach 2:
The patent divides the peeling process into two distinct stages: first creating a peeling starting point at a specific location (corner or circumference), then proceeding with the main peeling action. This segmentation allows controlled stress distribution, preventing the die from deforming or breaking during the peeling process
Data Source
AI summary
An object of the present invention is to provide a pickup device that can securely peel a die or to provide a reliable die bonder or a pickup method using the pickup device. To achieve the object, the present invention is provided with a characteristic that when a die to be peeled out of plural dies (semiconductor chips) applied to a dicing film is thrust up and is peeled from the dicing film, the dicing film in a predetermined part in a circumference of the die is thrust up and a peeling starting point is formed, the dicing film in a part except the predetermined part is thrust up, and the die is peeled from the dicing film.