Multiple Die Redistribution Layer for Semiconductor Pin-Out
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Solution Overview
Problem
The challenge in semiconductor packaging is the limited space on substrates for pin-out connections, which restricts the ability to transfer signal capabilities effectively, especially when die bond pads need to be relocated from one side of a die to another, and the use of jumper dies increases package thickness, making it impractical for low-thickness designs.
Innovation Solution
A multiple die redistribution layer is formed across paired semiconductor dies before singulation, where one die acts as a working die and the other as a dummy die, with the redistribution layer relocating bond pads from the working die to the dummy die, allowing for efficient pin-out positioning on the substrate, reducing the need for jumper wires and enabling thinner packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a redistribution layer is formed on a single die to relocate bond pads, then pin-out connections can be achieved on substrates with limited space, but the package thickness increases due to the need for jumper dies
Solution Approach 1:
The patent merges the functions of two separate dies into a single integrated structure. The redistribution layer is formed across both the first die and second die, creating a combined functional unit where the second die serves as an extension of the first die's bond pad array, eliminating the need for additional jumper dies and reducing overall package thickness.
Solution Approach 2:
The invention transitions from a single-die planar configuration to a multi-die stacked or adjacent configuration with vertical interconnections. By forming the redistribution layer across die boundaries and using vias to connect bond pads between dies, the solution adds a vertical dimension to the bond pad redistribution process, enabling space-efficient layouts without increasing package thickness.
2Area of stationary object
If jumper dies are used to relocate bond pads, then pin-out connections can be established on substrates with limited space, but the device complexity increases
Solution Approach 1:
The patent combines the redistribution function with the existing die structure by forming the redistribution layer across adjacent dies during the same fabrication process. This integration eliminates the need for separate jumper dies and reduces the number of discrete components and assembly steps, thereby reducing device complexity.
Solution Approach 2:
The redistribution layer is formed across multiple dies before they are mounted on the substrate. By performing the bond pad relocation operation during the die fabrication stage rather than during package assembly, the invention simplifies the overall device structure and reduces the complexity of subsequent packaging operations.
3Area of stationary object
If bond pads are relocated using conventional methods, then pin-out connections can be made on substrates with limited space, but manufacturing precision requirements increase
Solution Approach 1:
The redistribution layer is formed across multiple dies while they are still on the wafer or in close proximity, before final mounting. This preliminary formation allows for precise alignment to be established during the controlled fabrication environment, rather than requiring high-precision alignment during subsequent packaging operations where tolerances are tighter.
Solution Approach 2:
By forming the redistribution layer across adjacent dies in a single continuous process, the invention reduces the number of separate alignment operations required. The merged structure allows for more relaxed alignment tolerances compared to assembling multiple separate components with precise relative positioning requirements.
Data Source
AI summary
A semiconductor device and methods of forming same are disclosed having multiple die redistribution layer. After fabrication of semiconductor die on a wafer and prior to singulation from the wafer, adjacent semiconductor die are paired together and a redistribution layer may be formed across the die pair. The redistribution layer may be used to redistribute at least a portion of the bond pads from the first die in the pair to a second die in the pair. One die in each pair will be a working die and the other die in each pair will be a dummy die. The function of the integrated circuit beneath the redistribution layer on the dummy die is at least partially sacrificed.