Semiconductor Die Removal Tool With Roller-Gap Carrier Handling

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Manual removal of semiconductor dice or packages from carriers is time-consuming and prone to deformation or damage, leading to reduced output and increased defects in semiconductor manufacturing.

Innovation Solution

An automated tool with a shelf structure and rollers is used to efficiently remove semiconductor dice or packages from a carrier, minimizing deformation and damage by applying controlled forces and guiding the carrier through a gap, thereby increasing the units per hour (UPH) and improving reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If manual removal of semiconductor dice from carriers is used, then flexibility and simplicity are maintained, but productivity is reduced and defects increase

Engineering Contradiction:

Improveunits per hour (UPH)VSAvoidremoval tool structure

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The removal tool is divided into distinct functional modules: a shelf structure with multiple shelf portions creating defined gaps, a roller mechanism with multiple rollers positioned at different locations, and a driving structure. This segmentation allows each component to perform a specific function (support, apply force, drive motion) thereby achieving automated high-speed removal while keeping individual components relatively simple and manageable.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The roller acts as an intermediary element between the driving structure and the semiconductor dice. The roller transfers the driving force to the dice through controlled contact, enabling automated removal without direct mechanical manipulation. This intermediary mechanism allows for consistent, damage-free removal at high speeds while maintaining system modularity.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Manufacturing precision

If manual removal of semiconductor dice from carriers is used, then equipment complexity is minimized, but manufacturing precision deteriorates due to deformation and damage

Engineering Contradiction:

Improvedice integrity (no deformation, cracking, or delamination)VSAvoidautomated removal tool

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The shelf structure provides different local support conditions at different locations. The first shelf portion supports the carrier while the second shelf portion supports the removed dice, with gaps positioned to allow controlled interaction. This local differentiation ensures that each area of the tool provides the appropriate mechanical environment for its specific function, preventing deformation and damage during removal.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The gap between the first and second shelf portions is designed to accommodate the carrier and dice during the removal process, providing a controlled environment that prevents sudden impacts or excessive forces. This pre-designed spatial buffer protects the semiconductor dice from mechanical damage before they are fully removed from the carrier.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Productivity

If automated removal tool with rollers is used, then productivity is increased, but device complexity increases

Engineering Contradiction:

Improveunits per hour (UPH)VSAvoidtool operation complexity

Core Design Contradiction:

ProductivityVSEase of operation

Solution Approach 1:

Multiple functional elements are merged into a compact integrated structure. The shelf portions, rollers, and driving structure are combined in a single removal tool assembly that processes multiple dice simultaneously or in rapid sequence. This merging achieves high productivity while maintaining operational simplicity through unified control.

Inventive Principle:

Principle #5Merging (Combining)

4Productivity

If automated removal tool is used, then productivity increases, but the risk of harmful factors increases due to adhesive residue and delamination

Engineering Contradiction:

Improveunits per hour (UPH)VSAvoidadhesive residue and delamination

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The tool replaces manual mechanical manipulation with a controlled roller-based mechanical system. The roller applies consistent, distributed force to remove dice without the variability and excessive force that can cause adhesive residue or delamination. This systematic mechanical approach maintains high productivity while minimizing damage risks.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS20250299984A1Die and carrier removal tool and method of utilizing the same

Publication Date: 2025.09.25 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A tool is configured to, in operation, remove one or more semiconductor die or packages from a carrier, which may be a tape including an adhesive. The tool includes a shelf structure that includes a first side and a second side opposite to the first side. The shelf structure further includes a first shelf portion and a second shelf portion that are separated from each other by a gap. In operation, the carrier passes along a carrier pathway and the gap is along the carrier pathway such that the carrier passes through the gap. A first roller on the first side of the shelf structure freely rotates in operation guiding the carrier along the carrier pathway, and a second roller on the second side of the shelf structure is driven in operation to guide the carrier along the carrier pathway through the gap.