Die Repair Processing Layout With 1D Sequence Matching
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Solution Overview
Problem
In mass repair processes, the crystal-deficient state of dies on a source substrate leads to reduced die supply capacity, poor usage rate, and challenges in matching and calculating fully supplied combinations, especially when considering two-dimensional area matching, which is time-consuming and difficult to maintain consistency and repair yield.
Innovation Solution
A processing equipment with a supply unit, receiving unit, and motion unit that allows for one-dimensional area matching, where distribution patterns of receiving subsets are overlapped in a direction perpendicular to the supply sequence, maintaining distribution integrity and improving element usage rate and repair efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If two-dimensional area matching is used to match remaining dies on source substrate with positions to be repaired, then matching completeness may be improved, but calculation time increases significantly and matching success rate decreases when number of matchable dies is reduced
Solution Approach 1:
The patent segments the two-dimensional matching problem into multiple one-dimensional sequence matchings. The supply sequences and receiving sequences are divided into subsets that are matched independently in one dimension, then combined. This segmentation reduces computational complexity from O(n²) in two-dimensional matching to O(n) in one-dimensional matching, significantly decreasing calculation time while maintaining matching completeness.
Solution Approach 2:
The patent transforms the two-dimensional matching problem into a one-dimensional problem by projecting the matching onto supply sequences and receiving sequences arranged in linear order. By using distribution patterns that overlap in a direction perpendicular to the sequence arrangement, the patent achieves two-dimensional coverage through one-dimensional matching logic, reducing computational burden while maintaining matching effectiveness.
2Reliability
If two-dimensional area matching is used to ensure complete repair supply, then matching completeness may be improved, but device complexity and calculation difficulty increase
Solution Approach 1:
The patent segments the complex two-dimensional matching algorithm into simpler one-dimensional sequence matchings. By dividing supply and receiving positions into linear sequences with distribution patterns, the patent reduces algorithmic complexity from quadratic to linear time complexity, making the system more manageable and easier to implement while maintaining complete matching capability.
Solution Approach 2:
The patent resolves algorithmic complexity by changing the matching dimension from two-dimensional to one-dimensional. The distribution patterns that overlap perpendicular to the sequence direction enable two-dimensional coverage to be achieved through one-dimensional matching logic, significantly simplifying the algorithm while ensuring complete repair supply matching.
3Productivity
If remaining complete area on source substrate is used for repair, then repair requirements may be met, but die usage rate decreases
Solution Approach 1:
The patent implements dynamic matching where supply sequences and receiving sequences are flexibly aligned based on crystal orientation consistency rather than fixed positional mapping. The motion unit dynamically adjusts the relative positioning to match dies with consistent crystal orientations, optimizing both repair capacity and die usage rate by adapting to the actual distribution of usable dies on the source substrate.
Solution Approach 2:
The patent changes the matching parameter from fixed two-dimensional positional coordinates to one-dimensional sequence positions with distribution patterns. This parameter change allows the system to match dies based on crystal orientation consistency while maintaining optimal usage rate, as the one-dimensional sequencing enables flexible reordering and matching that respects material properties.
4Quantity of substance
If crystal-deficient state is present on source substrate, then die supply capacity decreases, but this creates opportunities for optimized one-dimensional sequence matching
Solution Approach 1:
The patent segments the supply and receiving positions into ordered sequences that can be independently optimized. Even when crystal-deficient states reduce overall die supply capacity, the segmentation into one-dimensional sequences with distribution patterns allows efficient matching of available dies, maximizing repair efficiency by systematically utilizing all usable dies rather than relying on two-dimensional area matching.
Data Source
AI summary
A processing equipment including a supply unit, a receiving unit, and a motion unit is provided. The supply unit has multiple supply sequences. Each of the supply sequences is provided with at least a first supply subset and a second supply subset. At least part of a first receiving subset is distributed in one receiving sequence. The motion unit is used to control a relative movement between the supply unit and the receiving unit, so that the first receiving subset and the second receiving subset are sequentially aligned with the first supply subset and the second supply subset of a supply sequence, and respectively define a first distribution pattern and a second distribution pattern on a supply surface of the supply unit. At least part of the first distribution pattern and at least part of the second distribution pattern are overlapped with each other in a direction.