Semiconductor Die Resin Layer Pickup to Prevent Warping
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Solution Overview
Problem
Existing semiconductor manufacturing methods face challenges in reliably attaching semiconductor dies due to warping and cracking, particularly when thinning occurs, as the load is applied only to the outer peripheral portion during suction, leading to insufficient bonding and void formation.
Innovation Solution
A method involving the use of a cured resin layer covering terminal electrodes, which is suctioned for pickup and attachment, ensuring even load distribution and preventing warping and cracking by covering the electrodes, with optional inclusion of inorganic fillers for enhanced hardness and elastic modulus.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the semiconductor die is suctioned by a collet avoiding the terminal electrodes, then the terminal electrodes are not damaged, but the semiconductor die may be bent or warped due to thinning
Solution Approach 1:
A cured resin layer is introduced as an intermediary substance covering the terminal electrodes. This resin layer serves as a mediator that allows the collet to suction the semiconductor die without directly contacting the terminal electrodes, thus preventing electrode damage while distributing the suction load to avoid die warping
Solution Approach 2:
The cured resin layer is formed on the semiconductor die before the mounting process. This preliminary action prepares the die surface with a protective and load-distributing layer that enables subsequent suction and attachment operations without causing warping or electrode damage
2Reliability
If the semiconductor die is pressed after suction mounting, then the die is attached to the support, but the load is applied only to the outer peripheral portion resulting in insufficient bonding or void formation
Solution Approach 1:
The cured resin layer provides a homogeneous surface that distributes the pressing load uniformly across the entire semiconductor die, including the central portion. This ensures consistent bonding between the die and support, preventing void formation and achieving uniform attachment quality
3Volume of moving object
If the semiconductor die is thinned to reduce size, then the device density increases, but the die becomes more susceptible to bending and cracking during handling
Solution Approach 1:
The cured resin layer acts as a cushioning layer formed beforehand on the thinned semiconductor die. This layer protects the fragile, thinned die from mechanical stresses during handling, suction, and attachment operations, preventing bending and cracking that would otherwise occur in thin dies
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for reliable attachment of semiconductor members without warping or cracking, facilitating easy formation and polishing of the resin layer, and ensuring uniform thermal expansion behavior, thereby improving manufacturing efficiency and reliability.
Implementation Method 1
picking up the semiconductor member by suctioning a surface of the cured resin layer of the semiconductor member with a holding member
Data Source
AI summary
As an example of a semiconductor device is disclosed. The semiconductor device 1 includes a semiconductor die 3 and a wiring layer 5a to which the semiconductor die 3 is attached. The semiconductor die 3 includes a semiconductor substrate 3a having a first surface and a second surface opposite thereto, a plurality of terminal electrodes 3b provided on the first surface of the semiconductor substrate 3a, and a cured resin layer 3c. The cured resin layer 3c is provided on the first surface of the semiconductor substrate 3a so as to cover the plurality of terminal electrodes 3c. The semiconductor die 3 can be, for example, a bride die that connects a semiconductor die 2a and a semiconductor die 2b to each other.