Semiconductor Package Stress-Relief Adhesive Between Die and Ring

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Solution Overview

Problem

Eccentrically arranged semiconductor devices in semiconductor packages experience increased stress on adhesive layers due to thermal cycling, leading to reliability issues and delamination risks.

Innovation Solution

Incorporating stress reduction members, such as adhesive members, between the semiconductor device and the ring structure, which are attached to both the substrate and the lid structure, to distribute stress and enhance package reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If adhesive members are added to reduce stress, then reliability is improved, but device complexity increases

Engineering Contradiction:

Improvepackage reliabilityVSAvoidpackage structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

Adhesive members are introduced as intermediary elements between the ring structure and the lid structure. These adhesive members act as stress-distributing mediators that prevent direct stress concentration on the adhesive layers, thereby improving package reliability without fundamentally changing the overall package architecture.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The adhesive connection is segmented into multiple components: the original adhesive layers bonding the semiconductor device to the substrate, and additional adhesive members bonding the lid structure to the ring structure. This segmentation distributes the stress across multiple adhesive interfaces rather than concentrating it on a single adhesive layer.

Inventive Principle:

Principle #1Segmentation

2Reliability

If adhesive members are added to distribute stress, then delamination resistance is improved, but manufacturing complexity increases

Engineering Contradiction:

Improvedelamination resistanceVSAvoidmanufacturing process simplicity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The adhesive members are positioned and attached to the ring structure before the lid structure is placed on top. This preliminary action allows the adhesive members to be properly aligned and bonded in advance, ensuring optimal stress distribution from the beginning and preventing delamination before the package is fully assembled.

Inventive Principle:

Principle #10Preliminary action

3Area of stationary object

If eccentric arrangement is used for semiconductor devices, then space utilization is improved, but stress concentration increases

Engineering Contradiction:

Improvespace utilizationVSAvoidadhesive layer stress

Core Design Contradiction:

Area of stationary objectVSStress or pressure

Solution Approach 1:

The adhesive members attached to the lid structure and ring structure act as counterbalancing elements that compensate for the asymmetric stress distribution caused by the eccentric semiconductor device arrangement. They provide additional structural support on the opposite side of the eccentric device, balancing the stress distribution across the package.

Inventive Principle:

Principle #8Anti-weight (Counterweight)

Data Source

PatentUS11894320B2Semiconductor device package with stress reduction design and method of forming the same

Publication Date: 2024.02.06 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A semiconductor device package and a method of forming the same are provided. The semiconductor device package includes a substrate, a semiconductor device, a ring structure, a lid structure, and an adhesive member. The semiconductor device is disposed over the substrate. The ring structure is disposed over the substrate and surrounds the semiconductor device. The lid structure is disposed over the ring structure and extends across the semiconductor device. The adhesive member is disposed in a gap between the ring structure and the semiconductor device and attached to the lid structure and the substrate.