Die Seal Leakage Detection Material in Semiconductor Interconnects
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Solution Overview
Problem
Integrated circuits face defects and delamination issues in interconnect layers due to undetected die seal leakages during manufacturing, leading to quick product failure.
Innovation Solution
Incorporating a sacrificial trench filled with a die seal leakage detection material, such as polyimide, between the die seal and the integrated circuit, which expands when exposed to moisture, allowing for early detection of defects during a stress test.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If standard manufacturing processes are used for die seals, then manufacturing simplicity is maintained, but defect detection capability deteriorates
Solution Approach 1:
The patent merges the protective die seal structure with an integrated detection material layer containing hygroscopic particles. This combination allows standard manufacturing processes to be used while simultaneously providing defect detection capability, as the detection material is incorporated into the existing interconnect layer structure.
Solution Approach 2:
The detection material layer changes its physical parameters (dimensional expansion, electrical properties) in response to moisture absorption. These parameter changes provide detectable signals that indicate die seal defects, enabling defect detection without complicating the manufacturing process.
2Difficulty of detecting and measuring
If detection material is added between die seal and interconnect layers, then defect detection capability is improved, but device complexity increases
Solution Approach 1:
The detection material layer serves multiple functions: it acts as a moisture sensor, a dimensional reference, and an electrical test element. This multi-functionality reduces the need for separate detection mechanisms, thereby limiting the increase in device complexity while improving defect detection capability.
Solution Approach 2:
The hygroscopic particles in the detection material layer undergo dimensional changes and electrical property changes when exposed to moisture. These changes can be detected through standard electrical testing methods, providing defect detection capability without requiring complex additional instrumentation or structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the early detection and removal of defective dies, reducing the likelihood of field failures and improving product quality by identifying defects before shipment.
Implementation Method 1
A die seal leakage detection material is arranged in the one or more interconnect layers between the die seal and the plurality of electrical connections
Implementation Method 2
The die seal provides a protection of the die seal leakage detection material from moisture if the die seal is intact
Data Source
AI summary
A semiconductor structure includes a semiconductor substrate, one or more interconnect layers provided over the substrate and a circuit. The circuit includes a plurality of circuit elements formed at the substrate and a plurality of electrical connections provided in the one or more interconnect layers. A die seal is provided in the one or more interconnect layers. A die seal leakage detection material is arranged in the one or more interconnect layers between the die seal and the plurality of electrical connections. The die seal provides a protection of the die seal leakage detection material from moisture if the die seal is intact. The die seal leakage detection material is adapted for providing a detectable modification of the circuit after an exposure of the die seal leakage detection material to moisture.