Semiconductor Die Sequencing for Low-Mismatch Power Modules
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Solution Overview
Problem
The existing die binning process in the semiconductor industry is inefficient, leading to logistical challenges, overhead costs, and undesirable bins with varying electrical performance specifications, resulting in mismatched components and reduced device performance.
Innovation Solution
A method and system for measuring component parameters and arranging them in a sequential order based on these parameters for shipping and device implementation, using a testing device and implementation system to ensure matched component parameters within power modules, reducing mismatch and improving performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional die binning is used to categorize finished dies, then component groups with similar ranges of characteristics can be obtained, but additional part numbers are created leading to logistical challenges and overhead costs
Solution Approach 1:
The patent changes the approach from categorical binning to sequential ordering based on measured parameters. Dies are measured for electrical characteristics and then arranged in sequential order (e.g., ascending or descending) rather than grouped into discrete bins. This parameter-based sequencing eliminates the need for multiple part numbers while maintaining electrical performance consistency within device implementations.
Solution Approach 2:
The patent segments the die population by measuring individual electrical parameters and creating a sorted sequence. Instead of creating homogeneous bins that require separate part numbers, the system segments dies into an ordered list that can be selectively assigned to device implementations, reducing logistical complexity while maintaining precision.
2Manufacturing precision
If traditional die binning is used to control die-to-die mismatch, then some level of electrical similarity is achieved, but the process is brute force and creates additional part numbers
Solution Approach 1:
The patent transitions from fixed categorical bins to dynamic parameter-based sequencing. By measuring specific electrical parameters and arranging dies in sequential order, the system achieves precise die-to-die mismatch control without the brute force approach of creating multiple bins and part numbers. The sequential order allows flexible assignment to device implementations.
3Adaptability or versatility
If multiple bins are created to satisfy different customer specifications, then electrical performance ranges can be matched, but significantly more logistical oversight is needed
Solution Approach 1:
The patent implements a dynamic system where dies are measured and arranged in sequential order based on their electrical parameters. This dynamic sequencing allows flexible adaptation to different customer specifications without creating fixed bins. The sequential arrangement can be selectively accessed to meet various performance requirements, reducing the need for multiple predetermined bins and associated logistical oversight.
4Reliability
If sequential ordering based on component parameters is implemented, then component mismatch is reduced and device performance is enhanced, but additional measurement and sorting processes are required
Solution Approach 1:
The patent performs preliminary measurement and sequential ordering of dies before device implementation. By measuring electrical parameters and creating a sorted sequence in advance, the system ensures consistent device performance without adding complexity during the actual device assembly process. The preliminary sorting enables straightforward selection from the pre-arranged sequence.
Data Source
AI summary
A process includes measuring at least one component parameter of a plurality of components with a testing device; and arranging at least a portion of the plurality of components in a sequential order based on the at least one component parameter with an implementation system in at least one of the following: a shipping format and a device implementation of the portion of the plurality of components. A system is disclosed as well.