Semiconductor Die Shielding Structure With Vertical Component Stacking
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Solution Overview
Problem
In device packages, the footprint is increased by shielding structures required to mitigate electromagnetic interference, which can affect the operation of semiconductor dies and other components, and existing methods do not effectively reduce this interference while maintaining package reliability.
Innovation Solution
A redistribution layer is formed over a semiconductor die with components mounted vertically, and a shielding structure is placed over the package to reduce the horizontal footprint and electromagnetic interference, using a stiff material embedded in the molding layer to enhance wire bonding reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shielding structure is provided between electromagnetic interference generating components and affected components, then electromagnetic interference is reduced, but the package footprint increases
Solution Approach 1:
The patent transitions from horizontal placement of components to vertical stacking arrangement. The semiconductor die is mounted on the circuit board substrate, with a first component mounted vertically over the die, and a shielding structure extending vertically over the component. This three-dimensional configuration reduces the horizontal footprint while maintaining electromagnetic shielding effectiveness.
Solution Approach 2:
The patent implements nested arrangement where the shielding structure is positioned over the first component, which is itself mounted over the semiconductor die. The molding layer encapsulates the die and extends under the component, creating nested protective and shielding layers that maximize space utilization within the vertical dimension.
2Area of stationary object
If components are mounted vertically over the semiconductor die, then the horizontal footprint is reduced, but wire bonding reliability may be compromised
Solution Approach 1:
The patent applies local quality by embedding a stiff material specifically in the molding layer under the portion of the wire bond contacting the redistribution layer. This localized reinforcement provides mechanical support exactly where needed for wire bonding reliability, while the rest of the package maintains its compact vertical structure.
3Reliability
If a stiff material is embedded in the molding layer under the wire bond, then wire bonding reliability is improved, but the device complexity increases
Solution Approach 1:
The patent merges the stiff material embedding with the existing molding layer formation process. The stiff material is embedded in the molding layer under the wire bond contact area, combining structural support and encapsulation functions into a single integrated layer, thereby reducing overall device complexity.
Data Source
AI summary
One or more structures and/or methods are provided. In an example of the subject matter presented herein, an apparatus includes a circuit board substrate. A package comprising a semiconductor die and a redistribution layer over the semiconductor die is mounted to the circuit board substrate. A first component is mounted to the redistribution layer over the semiconductor die. A shielding structure is mounted to the circuit board substrate over the package and the first component.