Die Side Redistribution Layer for High Density Interconnects
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Solution Overview
Problem
There is a need for smaller integrated device packages that can maintain or reduce the overall height and size while increasing interconnect density, as existing packages face challenges in routing and congestion of interconnects, which can lead to reliability issues.
Innovation Solution
The implementation of a die side redistribution layer (RDL) that provides additional interconnects laterally to the die, reducing the need for further redistribution in other portions of the package, thereby increasing routing interconnect density and reducing package size without increasing thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional substrate-based redistribution is used, then electrical paths can be provided for the die, but the package size and thickness increase due to routing congestion in the substrate
Solution Approach 1:
The patent introduces a die-side redistribution layer that extends laterally beyond the die edges into the encapsulant, utilizing the third dimension (depth/thickness) and lateral space that would otherwise be wasted. This allows interconnects to be routed in a new spatial dimension rather than being constrained to the substrate plane, thereby increasing interconnect density without increasing the overall package footprint.
Solution Approach 2:
The redistribution function is segmented into two distinct portions: a substrate-side redistribution layer and a die-side redistribution layer. This segmentation allows each portion to handle specific routing functions independently, with the die-side portion providing additional interconnect density without adding to the substrate thickness or lateral dimensions.
2Quantity of substance
If more interconnects are added to increase routing density, then electrical connectivity is improved, but congestion and reliability issues worsen
Solution Approach 1:
By extending redistribution layers laterally beyond the die edges into the encapsulant, the patent creates additional routing space in a dimension that does not contribute to package size. This allows more interconnects to be routed without increasing congestion in the traditional substrate routing layers, thereby maintaining reliability while increasing interconnect density.
3Volume of stationary object
If package size is reduced to meet miniaturization requirements, then portability is improved, but interconnect routing capability deteriorates
Solution Approach 1:
The patent utilizes the lateral space beyond die edges and the depth dimension within the encapsulant to route additional interconnects. This allows the package to maintain a compact footprint while providing high interconnect density through three-dimensional routing architecture, effectively decoupling package size from interconnect capability.
Solution Approach 2:
The die-side redistribution layer is nested within the encapsulant volume, utilizing the space that would otherwise be empty or filled with non-functional material. This nested arrangement allows additional interconnect routing without increasing the overall package dimensions, as the redistribution layer is contained within the existing package envelope.
Data Source
AI summary
A package that includes a second redistribution portion, a die coupled to the second redistribution portion, an encapsulation layer encapsulating the die, and a first redistribution portion coupled to the second redistribution portion. The first redistribution portion is located laterally to the die. The first redistribution portion is located over the second redistribution portion. The first redistribution portion and the second redistribution portion are configured to provide one or more electrical paths for the die.