Semiconductor Die Singulation Layout for Testing Pad Integrity
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Solution Overview
Problem
The semiconductor industry faces challenges in efficiently bonding and packaging stacked semiconductor devices due to the need for smaller and more creative packaging techniques, particularly in forming functional devices with active circuits on separate substrates, where existing bonding processes are not optimized for miniaturization and integration density.
Innovation Solution
A method for fabricating semiconductor dies involves forming integrated circuit components with seal rings and testing structures on a wafer, using a wafer saw process to singulate the components while preserving testing structures, and bonding them to form a package structure with hybrid bonding and encapsulation, ensuring efficient integration and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the wafer saw process is performed along a path that cuts through testing structures, then singulation efficiency is improved, but testing pad curling occurs and reliability deteriorates
Solution Approach 1:
The patent divides the wafer sawing path into segments that navigate around testing structures rather than cutting through them. The path is segmented to go between adjacent testing structures, preserving their integrity while still achieving singulation of the semiconductor components.
Solution Approach 2:
The patent introduces an intermediary path configuration that acts as a mediator between the need for efficient singulation and the need to preserve testing structures. The sawing path is designed to pass through intermediate regions between testing structures rather than directly through them.
2Manufacturing precision
If minimum feature size is reduced to increase integration density, then more components can be integrated, but packaging complexity increases
Solution Approach 1:
The patent transitions from planar 2D packaging to 3D stacked packaging, adding a vertical dimension to the packaging architecture. Multiple semiconductor components are bonded together in stacked configurations, allowing increased integration density without further reducing minimum feature size.
Solution Approach 2:
The patent implements nested packaging structures where smaller components are integrated within or between larger substrate structures. The stacked die configuration allows one component to be positioned above another, creating a nested vertical arrangement that increases density.
3Volume of moving object
If stacked semiconductor devices are bonded together to reduce physical size, then miniaturization is achieved, but bonding process complexity increases
Solution Approach 1:
The patent performs preliminary actions by forming bonding pads and preparing bonding surfaces on each semiconductor component before the stacking process. Test structures are also prepared in advance on the substrates, allowing for pre-bonding verification and reducing complexity during the actual bonding operation.
Solution Approach 2:
The patent implements self-service mechanisms where the bonding process utilizes the components' own structures (such as bonding pads and test structures) to facilitate alignment and verification. The test structures serve dual purposes: as process monitors during fabrication and as alignment references during bonding.
Data Source
AI summary
A method includes the following steps. A semiconductor wafer including integrated circuit components, seal rings respectively encircling the integrated circuit components and testing structures disposed between the seal rings is provided. A first wafer saw process is performed at least along a first path to singulate the semiconductor wafer into a plurality of first singulated integrated circuit components each including a testing structure among the testing structures. When performing the first wafer saw process, testing pads of the testing structures are located beside the first path, such that a testing pad of a corresponding one of the testing structures in the first singulated integrated circuit component is laterally spaced apart from a sidewall of the first singulated integrated circuit component by a distance.