Semiconductor Die Singulation Layout for Testing Pad Protection
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Solution Overview
Problem
The semiconductor industry faces challenges in miniaturization and packaging of semiconductor devices due to limitations in bonding processes for stacked semiconductor devices, which affect the integration density and efficiency of electronic components.
Innovation Solution
The proposed solution involves a process flow for fabricating top semiconductor dies that includes the use of seal rings and testing structures to protect and verify the integrity of integrated circuit components during the wafer sawing process, preventing damage to testing pads and improving the yield of 3D packaging by maintaining a keep-out-zone around the sawing paths and using hybrid bonding techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If wafer sawing process is performed to singulate semiconductor wafer, then integrated circuit components are separated into individual dies, but testing pads may be damaged or curled due to proximity to sawing paths
Solution Approach 1:
The patent introduces a keep-out zone that segments the wafer surface into testing areas and sawing areas, preventing sawing paths from directly contacting testing pads. This spatial segmentation allows simultaneous optimization of singulation efficiency and testing pad protection by defining distinct functional zones on the wafer.
Solution Approach 2:
The patent performs preliminary actions by forming seal rings around integrated circuit components and positioning testing structures with testing pads in specific locations before the wafer sawing process. These preliminary structural preparations ensure that when sawing occurs, the testing pads are already protected by the seal rings and properly positioned away from harmful sawing paths, preventing damage before it can occur.
2Quantity of substance
If bonding processes are used to stack semiconductor devices, then integration density is improved, but bonding yield is reduced due to process complexities and damage risks
Solution Approach 1:
The patent applies beforehand cushioning by introducing seal rings that encircle integrated circuit components and provide protective barriers during bonding processes. These seal rings cushion against potential damage from misalignment, stress, or contamination during stacking, thereby maintaining high bonding yield while enabling increased integration density through multi-die stacking.
3Area of stationary object
If testing structures are placed close to integrated circuit components, then wafer area utilization is improved, but testing pads become vulnerable to damage during sawing
Solution Approach 1:
The patent introduces seal rings as intermediary structures between the integrated circuit components and the testing pads, and between the testing structures and the sawing paths. These seal rings act as mediators that allow testing structures to be positioned close to components for efficient wafer utilization while simultaneously protecting testing pads from the harmful effects of sawing through the protective barrier provided by the seal rings.
Data Source
AI summary
A method includes the following steps. A semiconductor wafer including integrated circuit components, seal rings respectively encircling the integrated circuit components and testing structures disposed between the seal rings is provided. A first wafer saw process is performed at least along a first path to singulate the semiconductor wafer into a plurality of first singulated integrated circuit components each including a testing structure among the testing structures. When performing the first wafer saw process, testing pads of the testing structures are located beside the first path, such that a testing pad of a corresponding one of the testing structures in the first singulated integrated circuit component is laterally spaced apart from a sidewall of the first singulated integrated circuit component by a distance.