Automated Die Sorting Apparatus with Laser Positioning
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Solution Overview
Problem
Conventional die testing methods require manual selection, which can lead to damage to dies and neighboring chips, and random selection processes causing incomplete scanning and increased risk of releasing defective dies due to contact with vacuum needles and dicing tape deformation.
Innovation Solution
An automated die sorting apparatus with a fixing mechanism, positioning mechanism using a laser indicator, ejection mechanism with a pin and negative pressure system, and moving mechanism to precisely align and separate dies from a wafer based on coordinates, preventing damage and deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If manual selection of dies is performed using vacuum needle, then die picking is possible, but damage to selected die and neighboring dies occurs due to contact
Solution Approach 1:
The patent replaces the mechanical vacuum needle contact method with a non-contact optical positioning system using laser indicators to identify die coordinates, eliminating mechanical contact damage while maintaining picking capability
Solution Approach 2:
The patent introduces an intermediary optical indicator system that mediates between the selection process and the physical die, allowing precise identification without direct contact that causes damage
2Ease of operation
If manual random selection of die is performed, then die picking is possible, but wrinkles occur on dicing tape causing incomplete scanning and increased risk of releasing defective dies
Solution Approach 1:
The patent replaces manual random selection with an automated optical positioning system that uses laser indicators to precisely locate and mark die coordinates, eliminating tape wrinkles and ensuring complete scanning coverage
Solution Approach 2:
The patent implements a feedback mechanism where the optical indicator system provides real-time visual feedback on die positioning, allowing verification of correct die selection and ensuring complete scanning before picking
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus enables precise and automated sorting of semiconductor dies, preventing damage to selected and neighboring dies, and ensuring accurate scanning by aligning and ejecting dies with high precision, reducing the risk of defective die release.
Implementation Method 1
a negative pressure generating device configured to generate a negative pressure to hold the wafer on the fixing mechanism
Implementation Method 2
an ejection mechanism configured to apply a force to the selected die to separate the selected die from the wafer
Data Source
AI summary
A die sorting apparatus includes a fixing mechanism for fixing a wafer having a plurality of dies, a positioning mechanism including an indicator for selecting a die of the wafer using die coordinates, an ejection mechanism below the wafer for applying a force to the selected die, a moving mechanism mechanically coupled to the positioning mechanism and the ejection mechanism for aligning the positioning mechanism with the ejection mechanism according to the die coordinates. The ejection mechanism includes an ejection shaft, a pin driven by the ejection shaft to apply the force to the selected die, and a pin driving device for moving the pin up and down through the ejection shaft. The die sorting apparatus also includes a die pickup device mounted in parallel to or integrated in the positioning mechanism for picking up the selected die that is separated form the wafer through the pin.