Thin Heat Pipe Cooling Between Die Stacks and Fine-Pitch Interconnects
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Solution Overview
Problem
Die stacking in microelectronic devices leads to inefficient heat dissipation, particularly from lower dies, which can result in decreased device performance and structural damage due to trapped heat, and existing cooling methods like liquid cooling channels hinder the formation of high-density, fine-pitch interconnects.
Innovation Solution
A thin, integrated heat pipe element is positioned between dies, utilizing a thin thermal extraction and evacuation device with a wicking layer and capillary action to efficiently remove heat while allowing for short electrical interconnects, fabricated using semiconductor processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid cooling channels are used to cool die stacks, then heat dissipation is improved, but the formation of high-density fine-pitch interconnects is hindered
Solution Approach 1:
The cooling function is extracted from the interconnect structure. Instead of integrating cooling channels within the interconnect layers, the patent uses separate heat pipe elements positioned between dies, allowing independent optimization of both cooling and interconnect density without mutual interference
Solution Approach 2:
Heat pipe elements serve as intermediary components between the lower die and upper dies. These heat pipes act as thermal mediators that conduct heat away from the die stack without interfering with the electrical interconnect structure, enabling both effective cooling and high-density interconnects
2Area of stationary object
If die stacking is implemented to increase device performance, then space utility is optimized, but heat dissipation from lower dies becomes inefficient
Solution Approach 1:
The die stack is segmented with heat pipe elements inserted between individual dies. This segmentation allows each die to have dedicated thermal management, with heat pipes positioned at strategic locations to extract heat from lower dies before it accumulates, enabling efficient thermal management in vertically stacked configurations
Solution Approach 2:
Traditional liquid cooling channels are replaced with heat pipe technology. The heat pipes use phase change mechanisms (evaporation and condensation) rather than forced fluid flow, providing passive thermal management that is better suited for integrated die stacking without requiring complex pumping systems
3Temperature
If thick cooling elements are used to remove heat from lower dies, then heat dissipation is improved, but interconnect length increases causing higher impedance and latency
Solution Approach 1:
The heat pipe elements are designed as thin film structures that can be integrated between dies with minimal thickness. This thin-film approach provides effective thermal conduction and phase change cooling while maintaining a compact profile that does not significantly increase the overall stack height or interconnect lengths
Solution Approach 2:
The cooling function is moved to the vertical dimension by placing heat pipe elements between dies in the stack. This dimensional reorganization allows heat extraction to occur in the vertical direction without expanding the lateral footprint or requiring longer horizontal interconnect paths
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat pipe element effectively dissipates heat from lower dies, enabling high-density, fine-pitch interconnects with reduced impedance and latency, thus maintaining device performance and preventing structural damage.
Implementation Method 1
utilizing a thin thermal extraction and evacuation device with a wicking layer and capillary action to efficiently remove heat
Data Source
AI summary
An electronics package can comprise a first die, a cooling element disposed over the first die, a second die disposed over the cooling element, and a plurality of vias extending through the cooling element from the first die to the second die. The cooling element can comprise at least one cavity. The at least one cavity can comprise a wicking layer disposed over an interior surface of the at least one cavity.