Die Stack Package Layout With In-Footprint Device Integration
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Solution Overview
Problem
The microelectronic industry faces challenges in reducing the size and thickness of microelectronic packages while maintaining integration density and structural integrity, as existing technologies struggle to efficiently utilize space and reduce the surface area required on printed circuit boards.
Innovation Solution
A microelectronic package design that includes a die stack with a separate microelectronic device attached to the substrate within the footprint of one of the dice, allowing for a stacked configuration of dice with varying footprints, enabling better space utilization and improved structural integrity by placing devices closer to the die stack, which reduces signal length and enhances performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If devices are placed outside the die stack footprint, then ease of manufacturing is improved, but package size and surface area increase
Solution Approach 1:
The patent transitions from a two-dimensional layout where all devices are placed on the substrate plane to a three-dimensional configuration by stacking dice vertically. This allows devices to be positioned within the footprint of the die stack rather than outside it, reducing the required surface area while maintaining manufacturing feasibility through vertical integration.
Solution Approach 2:
The patent implements nesting by placing additional devices within the footprint boundary of the die stack, effectively utilizing the vertical space above the substrate. This nested arrangement allows multiple devices to occupy overlapping footprints when viewed from the top, thereby reducing the total surface area required.
2Productivity
If integration density is increased, then productivity is improved, but device complexity increases
Solution Approach 1:
The patent divides the integrated system into separate functional dice that are stacked vertically. Each die can be independently designed, manufactured, and tested, simplifying the overall device complexity while achieving high integration density through the stacked configuration. This segmentation allows complex functions to be distributed across multiple simpler components.
Data Source
AI summary
A microelectronic package may be fabricated having a microelectronic die stack attached to a microelectronic substrate and at least one microelectronic device, which is separate from the microelectronic die stack, attached to the microelectronic substrate within the footprint of one of the microelectronic dice within the microelectronic die stack. In one embodiment, the microelectronic die stack may have a plurality of stacked microelectronic dice, wherein one microelectronic die of the plurality of microelectronic dice has a footprint greater than the other microelectronic die of the plurality of microelectronic dice, and wherein the at least one microelectronic device is attached to the one microelectronic die of the plurality of microelectronic dice having the greater footprint.