3D Die Stack Package Layout for Low-Noise Heat Dissipation
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Solution Overview
Problem
There is a need for semiconductor packages that can reduce size and weight while improving electrical characteristics and heat dissipation for portable electronic devices, particularly those that process high-frequency signals.
Innovation Solution
A semiconductor package is designed with a substrate, a die stack comprising multiple layers of wafers with interconnection layers and through electrodes, and a heat radiator for efficient heat dissipation, where the wafers are bonded using metal-to-metal or oxide-to-oxide hybrid bonding to enhance structural stability and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple substrates are stacked to integrate multiple components, then component integration is improved, but package size and weight increase
Solution Approach 1:
The patent implements a stacked package structure where multiple substrates (first substrate, second substrate, third substrate) are vertically nested one on top of another. Each substrate contains functional components, and they are interconnected through through-electrodes that penetrate through the stack. This nesting approach allows multiple components to be integrated in a compact vertical arrangement, achieving high component integration while controlling package footprint and weight.
2Adaptability or versatility
If multiple substrates are stacked to integrate multiple components, then component integration is improved, but package volume increases
Solution Approach 1:
The patent transitions from a planar (2D) arrangement of components to a three-dimensional (3D) stacked configuration. Multiple substrates are arranged vertically along the Z-axis, with through-electrodes providing interconnections between layers. This dimensional change allows components to be packed more densely by utilizing vertical space, thereby achieving high component integration without proportionally increasing package volume.
3Reliability
If bonding wires are used to connect substrates, then electrical connectivity is achieved, but signal noise increases
Solution Approach 1:
The patent replaces the traditional mechanical bonding wire system with a direct through-electrode connection system. Instead of using flexible bonding wires that extend from pad to pad across substrate surfaces, the invention employs rigid through-electrodes that penetrate through the substrates and provide direct electrical pathways. This substitution eliminates the mechanical wire structure that causes signal noise, while maintaining reliable electrical connectivity through the through-electrode connections.
4Volume of moving object
If component size is reduced for portable devices, then device portability is improved, but heat dissipation becomes more difficult
Solution Approach 1:
The patent employs a stacked configuration where multiple substrates are nested vertically. This nesting structure allows heat generated by compact components to be conducted through the substrate stack to external heat dissipation surfaces. The through-electrodes and substrate layers act as thermal pathways, enabling effective heat dissipation from the miniaturized components while maintaining their small size for portable device applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves electrical characteristics by reducing signal noise and heat dissipation, allowing for more compact and efficient semiconductor packages.
Implementation Method 1
The second wafer comprises a first through electrode that penetrates the second wafer, extends from the second interconnection layer toward a bottom surface of the second wafer
Implementation Method 2
the second wafer is on the first wafer such that the second interconnection layer is in contact with the first interconnection layer
Implementation Method 3
a heat radiator for efficient heat dissipation
Data Source
AI summary
A semiconductor package includes a substrate, a die stack on the substrate, and connection terminals between the substrate and the die stack. The die stack includes a first die having a first active surface facing the substrate, the first die including first through electrodes vertically penetrating the first die, a second die on the first die and having a second active surface, the second die including second through electrodes vertically penetrating the second die, and a third die on the second die and having a third active surface facing the substrate. The second active surface of the second die is in direct contact with one of the first or third active surfaces.