Semiconductor Die Stack Layout for Lower Package Height
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Solution Overview
Problem
The reduction of semiconductor die stacks' volume is limited by passive electrical components, such as capacitors, which occupy significant volume and restrict further height reduction.
Innovation Solution
Incorporating low-profile capacitors underneath the die stack and using encapsulant materials to support and stabilize the stack, allowing for reduced overall package height and footprint while maintaining structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If semiconductor die thickness is reduced to decrease stack height, then the height of the semiconductor die stack is reduced, but the overall package height cannot be reduced further because passive electrical components become the limiting factor
Solution Approach 1:
The patent transitions passive electrical components from a vertical arrangement (stacked above the die) to a lateral arrangement (positioned beside the die on the same substrate plane). This dimensional change allows the components to no longer contribute to the package height, effectively resolving the height limitation while maintaining all necessary functional components.
2Quantity of substance
If multiple semiconductor dies are stacked vertically to increase capacity, then the capacity and performance are improved, but the overall volume and height of the assembly increase
Solution Approach 1:
The patent merges the vertical stacking of semiconductor dies with the placement of passive electrical components on the same lateral plane. By combining these previously separate spatial arrangements into a unified two-dimensional layout, the design achieves high die capacity while preventing proportional increases in overall assembly volume.
3Device complexity
If passive electrical components are positioned above the die stack, then electrical connections are simplified, but the package height increases and volume reduction is limited
Solution Approach 1:
The patent repositions passive electrical components from the vertical dimension (above the die stack) to the lateral dimension (beside the die on the substrate). This spatial reconfiguration eliminates their contribution to package height while electrical connections are maintained through lateral routing on the substrate plane.
Data Source
AI summary
Semiconductor devices and associated systems and methods are disclosed herein. In some embodiments, the semiconductor device is an assembly that includes a package substrate having a front side and a backside opposite the front side. A controller die with a first longitudinal footprint can be attached to the front side of the package substrate. A passive electrical component is also attached to the front side of the package substrate. A stack of semiconductor dies can be attached to the controller die and the passive electrical component. The stack of semiconductor dies has a second longitudinal footprint greater than the first longitudinal footprint in at least one dimension. The controller die and the passive electrical component are positioned at least partially within the second longitudinal footprint, thereby at least partially supporting the stack of semiconductor dies.