Die-Stacked Battery Backup for Volatile Memory Retention
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Solution Overview
Problem
Volatile memory in computing systems loses data when power is interrupted, leading to increased system latency and energy consumption during recovery.
Innovation Solution
Integration of a battery module with a die-stacking package, where the battery supplies power to volatile memory when the main power supply is off, and a temperature sensor and control logic unit manage power distribution to prevent power leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a battery module is integrated with the die-stacking package to supply power to volatile memory during power outages, then data loss is prevented and reliability is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The battery module is physically integrated with the die-stacking package by disposing it on a top portion of an integrated circuit die element, merging the power backup function with the existing memory structure. This integration maintains data retention reliability while minimizing the increase in device complexity through spatial consolidation.
Solution Approach 2:
The integrated circuit die element serves multiple functions: it houses the volatile memory, contains the battery module for power backup, and includes temperature sensors and control logic for thermal management. This multi-functionality approach consolidates multiple components into a single integrated unit, improving reliability without proportionally increasing device complexity.
2Reliability
If temperature sensors and control logic are added to manage power distribution and prevent overheating, then thermal protection is improved and reliability increases, but device complexity and energy consumption increase
Solution Approach 1:
Temperature sensors continuously monitor the thermal state of the die-stacking package and feed this information to control logic. The control logic adjusts power distribution from the battery module based on temperature feedback, enabling dynamic thermal management. This feedback mechanism provides reliable thermal protection while optimizing energy consumption by activating power management only when thermal conditions require intervention.
3Reliability
If the battery module is disposed on the top portion of the integrated circuit die element, then power supply reliability is improved without significantly increasing area, but manufacturing precision requirements increase
Solution Approach 1:
The battery module is nested on top of the integrated circuit die element, which itself is part of a multi-layer die-stacking structure. This nested arrangement allows the battery to be integrated into the existing vertical stacking architecture, providing power supply reliability while utilizing the three-dimensional space already allocated for die stacking, thereby minimizing additional manufacturing precision requirements.
Data Source
AI summary
A system comprises an integrated circuit die substrate; volatile memory electrically coupled to the integrated circuit die substrate; a first integrated circuit die element electrically coupled to the integrated circuit die substrate, the first integrated circuit die element comprising a first field programmable gate array (FPGA), and the first integrated circuit die element disposed adjacent to the volatile memory; a battery charger operable to receive power from a main power supply, the main power supply having an on state and an off state, wherein the main power supply is supplying power in the on state and not supplying power in the off state; and a battery module disposed on a top portion of the first integrated circuit die element, the battery module operable to receive power from the battery charger, and the battery module operable to supply power to the volatile memory at least when the main power supply is in the off state.