Die-Stacked Memory Data Translation Controller
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Solution Overview
Problem
Processing systems face bandwidth and latency limitations due to the separation of system memory from processors and other components, leading to inefficiencies in data translation operations that incur double memory access penalties and increased power consumption.
Innovation Solution
Implementing a die-stacked memory device with a reconfigurable logic device and data translation controller that performs data manipulation and translation operations internally, reducing reliance on external memory interconnects and allowing for dynamic configuration and efficient data handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If data translation operations are performed using external system memory, then implementation flexibility is maintained, but inter-device bandwidth and latency penalties are incurred twice for each data translation
Solution Approach 1:
The patent merges the data translation functionality with the memory device by integrating a reconfigurable logic device directly into the memory die. This allows data translation operations to be performed internally within the memory device rather than requiring external memory accesses, thereby eliminating the double bandwidth and latency penalties while maintaining implementation flexibility through the reconfigurable logic.
Solution Approach 2:
The patent transitions from a planar, external memory access approach to a three-dimensional integrated approach by stacking the reconfigurable logic device over the memory array. This vertical integration enables data translation to occur in-situ within the memory device, reducing the dimensional path length for data access and eliminating the need for round-trip memory accesses.
2Device complexity
If data translation operations are performed using external system memory, then system architecture remains simple, but processing efficiency is reduced due to bandwidth and latency limitations
Solution Approach 1:
The patent embeds the reconfigurable logic device within the memory device structure, creating a nested architecture where the logic device is integrated over the memory array. This nesting enables data translation operations to be performed internally without complicating the overall system architecture, as the enhanced functionality is contained within the memory device itself rather than requiring complex external connections.
3Ease of operation
If data translation operations are performed using external memory, then memory access operations are straightforward, but power consumption increases due to repeated data transfers
Solution Approach 1:
The patent enables the memory device to perform data translation operations autonomously using its integrated reconfigurable logic device. This self-service capability allows the memory device to translate data internally without requiring repeated external memory accesses, thereby reducing power consumption while maintaining ease of operation through transparent data translation functionality.
Data Source
AI summary
A die-stacked memory device incorporates a data translation controller at one or more logic dies of the device to provide data translation services for data to be stored at, or retrieved from, the die-stacked memory device. The data translation operations implemented by the data translation controller can include compression/decompression operations, encryption/decryption operations, format translations, wear-leveling translations, data ordering operations, and the like. Due to the tight integration of the logic dies and the memory dies, the data translation controller can perform data translation operations with higher bandwidth and lower latency and power consumption compared to operations performed by devices external to the die-stacked memory device.