Die Stacking Recess Notches for Precise Angular Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor device packaging technologies struggle with precise angular alignment of multiple devices within a package, particularly in multi-axis sensors, leading to inaccuracies and misalignment issues.
Innovation Solution
The use of alignment recesses in cover substrates with notches in diagonally opposite corners to constrain the angular orientation of additional substrates to within specific degrees of rotation, utilizing mechanical features to enhance registration accuracy during assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional assembly methods are used to package multiple sensors, then assembly simplicity is maintained, but angular alignment precision deteriorates
Solution Approach 1:
The alignment recess with precisely positioned notches is formed in advance on the first substrate before sensor assembly. This preliminary structural preparation ensures that when the second substrate with sensors is placed into the recess, automatic angular alignment occurs without requiring complex active alignment mechanisms or high-precision positioning equipment during assembly.
Solution Approach 2:
The alignment recess acts as an intermediary structural element between the first substrate and the second substrate. It provides a mechanical interface that transmits and constrains the angular orientation relationship, ensuring precise alignment through passive geometric constraints rather than active control systems.
2Measurement precision
If loose angular alignment is accepted, then assembly ease is improved, but sensor accuracy deteriorates
Solution Approach 1:
The alignment recess incorporates asymmetric notch configurations positioned at specific angular locations. This asymmetric design creates unique mechanical engagement points that automatically define the correct angular orientation of the sensors, eliminating rotational ambiguity and ensuring precise alignment while maintaining simple assembly procedures.
Solution Approach 2:
The precise angular alignment features are pre-formed on the first substrate before assembly operations. This preliminary preparation embeds the alignment information in the structure itself, allowing subsequent assembly steps to proceed without requiring complex positioning or adjustment procedures, thus maintaining ease of manufacture while achieving high measurement precision.
Data Source
AI summary
An alignment recess formed in a cover substrate such as a cover for a MEMS device allows a second substrate to be bonded to the cover substrate. The alignment recess is larger than the second substrate and has two corner regions diagonally opposite each other where a wall of the recess protrudes to form a notch. The notch is dimensioned such that when the second substrate is disposed within the recess with two opposing corners surrounded by respective notches of the recess, the angular position of the second substrate relative to the cover substrate can be controlled to within a desired amount of rotation.