3D Die Stacking Seal Ring Layout for Crack-Resistant Hybrid Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor packaging technologies face challenges in achieving durable and reliable electrical integration between stacked semiconductor dies and other devices, particularly in maintaining strong interfacial bonding and preventing cracking or delamination during the dicing process.
Innovation Solution
The implementation of a 3D stacking structure manufacturing process involving hybrid bonding with dielectric-to-dielectric and metallic-to-metallic bonding, using metallization structures with seal ring structures and dummy pads, and a filling material to create a metal-free dielectric buffer zone, which enhances bonding reliability and structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging technologies are used for stacking semiconductor dies, then the manufacturing process is simpler, but the interfacial bonding reliability is poor and cracking or delamination occurs during dicing
Solution Approach 1:
The bonding interface is segmented into multiple functional zones: seal ring structures for mechanical sealing and stress distribution, dummy pads for bonding enhancement, and metal-free dielectric buffer zones for stress isolation. This segmentation allows each component to optimize its function, improving overall bonding reliability without requiring complete process redesign
Solution Approach 2:
The seal ring structures, dummy pads, and metal-free dielectric buffer zones are formed on the semiconductor dies before the stacking and dicing processes. This preliminary preparation ensures that when stacking occurs, the bonding interface is already optimized to prevent cracking and delamination during subsequent manufacturing steps
2Strength
If strong interfacial bonding is achieved through hybrid bonding, then bonding strength improves, but the manufacturing precision requirements increase
Solution Approach 1:
The bonding interface has non-uniform local properties: seal rings provide mechanical support and stress distribution in peripheral regions, dummy pads create localized bonding enhancement zones, and metal-free dielectric buffer zones provide stress isolation. This local quality variation allows strong bonding without requiring uniform high precision across the entire interface
Solution Approach 2:
The dummy pads and metal-free dielectric buffer zones act as intermediary elements between the bonding surfaces. These intermediaries distribute stresses and accommodate minor misalignments, enabling strong hybrid bonding while reducing the stringency of alignment precision requirements
3Reliability
If seal ring structures and dummy pads are added to enhance bonding, then bonding reliability improves, but the device complexity increases
Solution Approach 1:
The seal ring structures, dummy pads, and metal-free dielectric buffer zones are integrated into a unified bonding interface design that works synergistically. The seal rings provide mechanical support, dummy pads enhance bonding, and buffer zones prevent stress concentration - together they achieve high reliability without requiring separate complex systems for each function
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in improved bonding strength, reduced cracking, and increased production yield by establishing a reliable interfacial bonding interface and minimizing delamination, while maintaining electrical connectivity between semiconductor dies.
Implementation Method 1
hybrid bonding with dielectric-to-dielectric and metallic-to-metallic bonding
Data Source
AI summary
A stacking structure including a first die and a second die bonded with the first die is provided. The first die has a first region and a second region encircled by the first region. The first die includes first metallization structures having a first seal ring structure and a first bonding structure having first dummy pads located over the first seal ring structure. The second die includes second metallization structures having a second seal ring structure and a second bonding structure having second dummy pads located over the second seal ring structure. The first die and the second die are bonded through bonding of the first and second bonding structures. The first and second seal ring structures are substantially vertically aligned, and the first dummy pads are respectively bonded with the second dummy pads.