Die Stacking Via Pad Layout for Signal Path Flexibility
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Solution Overview
Problem
Conventional methods for signal transmission between stacked dies require changes to micro bumps and redistribution layer (RDL) routing, leading to increased fabrication costs when design changes are needed.
Innovation Solution
A layout structure and method for a die that includes conductive vias and pads on both sides, with conductive bumps allowing for various signal transmission paths, enabling changes in signal transmission without altering the RDL routing or micro bumps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional RDL routing and micro bumps are used for signal transmission between stacked dies, then signal transmission is achieved, but fabrication cost increases when design changes are required
Solution Approach 1:
The patent segments the signal transmission path into multiple configurable routes by introducing intermediate pads and selective conductive bump connections. Instead of a fixed direct connection, the signal can be routed through different sequences of pads and conductive bumps, allowing flexible path selection without changing the underlying RDL or micro bump structure.
Solution Approach 2:
The patent creates a dynamic signal transmission system where the active transmission path can be changed by selectively activating different conductive bumps. The conductive bumps act as switchable connection points that enable or disable specific routing paths, providing adaptability while maintaining a fixed physical structure.
2Adaptability or versatility
If RDL routing is redesigned to change signal transmission mode, then new design requirements are met, but fabrication cost increases
Solution Approach 1:
The patent extracts the routing flexibility from the RDL layer and relocates it to the conductive bump configuration. The RDL routing becomes fixed and simplified, while the adaptability is achieved through selective activation of conductive bumps that create different effective signal paths without requiring RDL changes.
Solution Approach 2:
The patent introduces intermediate pads as mediators between the fixed RDL routing and the final signal transmission path. These intermediate pads, combined with selectively activated conductive bumps, allow the signal to be redirected through different routes without modifying the underlying RDL structure, thus decoupling routing flexibility from RDL complexity.
3Adaptability or versatility
If micro bumps layout is changed to achieve new signal transmission mode, then design requirements are met, but manufacturing complexity increases
Solution Approach 1:
The patent performs preliminary action by pre-positioning all conductive bumps in a fixed layout during manufacturing. The adaptability is then achieved not by changing the micro bump layout, but by selectively activating pre-positioned conductive bumps through control signals, thereby maintaining manufacturing simplicity while providing operational flexibility.
Data Source
AI summary
A layout structure and layout method are provided. The layout structure includes a first conductive via, a second conductive via, a die and eight pads. The first conductive via and the second conductive via pass through the die. The first conductive via has a first pad and a second pad, and the second conductive via has a third pad and a fourth pad. A fifth pad is conducted to the third pad. A sixth pad is conducted to the second pad. A seventh pad is conducted to the first pad. An eighth pad is conducted to the fourth pad. In a vertical direction of the die, the first pad and the second pad are overlapped, the third pad and the fourth pad are overlapped, the fifth pad and the sixth pad are overlapped, and the eighth pad and the seventh pad are overlapped, partially or totally.