Die Stackup Connection Platform for Shorter Bond Wires
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Solution Overview
Problem
Conventional semiconductor device packages with stacked dies face issues of increased noise and inductance in electrical signals due to long bond wires, and a higher risk of electrical shorts as pitch between bond pads decreases, necessitating a solution to reduce signal noise and prevent shorts.
Innovation Solution
The semiconductor device package incorporates a substrate with a stack of dies positioned between two platforms, featuring through-vias and bond wires that minimize wire length and inductance, and include stepped surfaces with bond pads to reduce the risk of electrical shorts by spacing bond wires vertically and using conductive and dielectric layers to minimize via diameter.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If long bond wires are used to connect stacked dies to the substrate, then the electrical connection is achieved, but signal noise and inductance increase
Solution Approach 1:
The patent introduces through-vias as intermediary conductive structures that extend vertically through the substrate to provide direct electrical pathways to stacked dies. These through-vias act as mediators between the substrate and dies, replacing long bond wires and thereby reducing signal noise and inductance while maintaining reliable electrical connections.
Solution Approach 2:
The patent transitions from planar bond wire connections to three-dimensional vertical through-via connections. By utilizing the vertical dimension through the substrate thickness, the design achieves shorter effective connection lengths and reduced inductance compared to traditional lateral bond wire paths.
2Productivity
If pitch between bond pads decreases to increase density, then more dies can be connected, but the risk of electrical shorts increases
Solution Approach 1:
The patent moves bond wire connections into the vertical dimension using through-vias that pass through the substrate. This vertical separation in the z-direction provides natural isolation between adjacent bond wires, allowing closer horizontal spacing of bond pads without increasing short risk, thereby enabling higher die stacking density.
Solution Approach 2:
The substrate is segmented into multiple through-vias that are spatially distributed and electrically isolated from each other. Each through-via serves as an independent conductive pathway, and the segmentation of the connection architecture allows dense packing of bond pads while maintaining electrical isolation between adjacent connections.
3Object-affected harmful factors
If through-vias and platforms are added to reduce bond wire length, then signal noise and inductance are reduced, but device complexity increases
Solution Approach 1:
The patent merges the functions of electrical connection, mechanical support, and signal routing into integrated through-via structures and platforms. By combining multiple functions into unified components, the design reduces overall package complexity despite adding vertical interconnect features.
Solution Approach 2:
The through-vias serve multiple functions simultaneously: providing electrical connections, reducing inductance, enabling vertical signal routing, and supporting the stacked die architecture. This multi-functionality reduces the need for separate components, thereby managing device complexity while achieving multiple performance benefits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces signal noise, minimizes inductance, and decreases the risk of electrical shorts by optimizing bond wire length and distribution, thereby enhancing signal integrity and reducing the load on top dies in the stack.
Implementation Method 1
a first through-via electrically connected to the substrate and extending through the first platform, a second through-via electrically connected to the substrate and extending through the second platform
Implementation Method 2
a first bond wire electrically connecting the first through-via to the first semiconductor die, and a second bond wire electrically connecting the second through-via to the second semiconductor die
Data Source
AI summary
A semiconductor device package includes a substrate and a stack of semiconductor dies positioned on the substrate that includes a first semiconductor die and a second semiconductor die. First and second platforms are positioned on the substrate such that the stack of semiconductor dies is positioned therebetween. First and second through-vias are electrically connected to the substrate and extending through the respective first and second platforms. A first bond wire electrically connects the first through-via to the first semiconductor die, and a second bond wire electrically connects the second through-via to the second semiconductor die. The through-vias may reduce the required length of the bond wires thereby reducing signal noise and the platforms may vertically space the bond wires from one another to prevent electrical short circuits.