Die-Substrate Power Converter Layout for Shorter GPU Power Paths
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing integrated circuit packages face challenges with high power consumption, inefficiencies in power distribution, and increased complexity due to large power converter modules and lengthy current paths from the package substrate to the circuit die, leading to reduced GPU performance and increased manufacturing costs.
Innovation Solution
The integration of a power converter module directly onto the circuit die substrate, reducing the length of high voltage input paths and incorporating power regulation components, such as capacitors, inductors, and transistors, to minimize power loss and complexity by routing high voltage inputs closer to the perimeter of the die substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If power converter modules are integrated directly onto the circuit die substrate, then power loss is reduced and power efficiency is improved, but device complexity increases due to integration of multiple components
Solution Approach 1:
The patent merges the power converter module with the circuit die substrate by integrating capacitors, inductors, and transistors directly onto the substrate. This consolidation eliminates separate power converter components and their associated connections, reducing power loss while managing complexity through unified design.
Solution Approach 2:
The patent transitions from traditional planar power converter layouts to a three-dimensional vertical stacking architecture. Power converter components are stacked vertically on the circuit die substrate, reducing the horizontal footprint and minimizing current path lengths, thereby reducing power loss without proportionally increasing device complexity.
2Loss of energy
If high voltage input paths are routed closer to the perimeter of the die substrate, then power loss is reduced due to shorter path lengths, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies different routing strategies to different regions of the die substrate. High voltage input paths are specifically routed along the perimeter where path lengths are minimized, while other circuit elements maintain their optimal layouts. This localized optimization reduces power loss in critical paths without compromising overall manufacturing precision.
3Ease of manufacture
If the number of solder balls is reduced through integrated power converter module, then manufacturing costs are reduced and ease of manufacture is improved, but reliability may be affected
Solution Approach 1:
The integration of power converter modules with the circuit die substrate consolidates multiple components into a single unit, reducing the total number of solder balls required for assembly. This simplifies the manufacturing process and reduces assembly complexity while maintaining reliability through integrated design that eliminates external connections.
4Area of stationary object
If power converter module components are stacked vertically, then area occupied is reduced and power paths are shortened, but manufacturing precision requirements increase
Solution Approach 1:
The patent implements vertical stacking of power converter components (capacitors, inductors, transistors) on the circuit die substrate, transitioning from a two-dimensional planar layout to a three-dimensional structure. This reduces the horizontal area occupied by the power converter module and shortens current path lengths, while manufacturing precision is managed through standardized vertical stacking processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces power loss by minimizing DC resistance, simplifies solder ball and tracing designs, and enhances thermal cooling efficiency, resulting in improved power efficiency and reduced manufacturing costs, with simulations showing a 5-fold reduction in power loss and a significant decrease in the number of solder balls required.
Implementation Method 1
the power converter module converts the high voltage input power to a low voltage output power
Implementation Method 2
a low voltage power trace located on the first die surface and electrically connected to the power converter module to carry the low voltage output power
Data Source
AI summary
An integrated circuit package including a die substrate having a first and second die surfaces, a die high voltage input power connection in the die substrate to receive a high voltage input power and transmit the high voltage input power to a high voltage power trace on the first die surface, a power converter module on the first die surface and electrically connected to the high voltage power trace to convert the high voltage input power to a low voltage output power, a low voltage power trace located on the first die surface and electrically connected to the power converter module to carry the low voltage output power to a circuit die on the first die surface. A method of manufacturing the integrated circuit package and a computer having one or more circuits that include the package is also disclosed.