Die Supports for Oversized Chip Packages
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Solution Overview
Problem
Chip packages face mechanical stress and damage when an oversized die is mounted on a die flag, as the die extends beyond the edges, putting pressure on connections like wire bonds.
Innovation Solution
Incorporating non-conductive die supports around the die flag to distribute the weight and forces, allowing for oversized dies to be mounted without exceeding the die flag area, using materials like epoxy and configuring the supports to run parallel to the die flag's edges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the die area is made larger than the die flag area, then the chip package can accommodate larger dies for improved performance, but the die and connections become susceptible to mechanical stress and damage
Solution Approach 1:
The support structure is segmented into multiple die supports positioned at different locations on the die flag. Each die support independently carries a portion of the die weight and distributes mechanical stress, allowing the die area to exceed the die flag area while maintaining reliability through distributed load bearing.
Solution Approach 2:
Die supports act as intermediary elements between the die and the die flag. These intermediaries provide additional support surfaces that extend beyond the die flag boundaries, enabling oversized dies to be mounted without directly transferring all mechanical stress to the die flag edges and connections.
2Area of moving object
If the die area exceeds the die flag area, then larger dies can be used, but the connections (e.g., wire bonds) become susceptible to mechanical stress and damage
Solution Approach 1:
The support function is segmented across multiple die supports positioned strategically around the die flag. This segmentation distributes the mechanical load away from the wire bond connections, allowing larger die areas while preserving connection strength through distributed stress support.
Solution Approach 2:
Die supports are positioned beforehand to provide cushioning support for oversized dies. By pre-positioning these support elements on the die flag, the structure is prepared to absorb and distribute mechanical stresses before they reach the vulnerable wire bond connections, protecting them from damage.
Data Source
AI summary
A chip package, in some embodiments, comprises: a die flag; one or more die supports; and a die mounted on the die flag and on said one or more die supports, at least one surface of said die having an area larger than an area of at least one surface of the die flag.