Die Tester with Movable Probes for Parallel Semiconductor Testing
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Solution Overview
Problem
Current semiconductor die testing methods are inefficient, leading to low throughput and increased manufacturing costs due to the need for sequential testing of each die, which hampers the ability to quickly sort good devices from defective ones.
Innovation Solution
A die tester system with adjustable and movable probes that can test multiple dice in an array by positioning test points on multiple dice simultaneously, allowing for simultaneous testing of two dice with each movement of the workpiece positioning table, regardless of variations in test point pitch, position, or dimension.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If sequential testing of each die is used, then testing accuracy is maintained, but throughput is low and testing time is long
Solution Approach 1:
The patent merges multiple testing operations into a single system by positioning multiple probes (first, second, third, and fourth probes) to simultaneously test multiple dice. The probes are arranged in fixed positions with fixed separation distances that correspond to predetermined test points on multiple dice, enabling parallel testing operations.
Solution Approach 2:
The patent employs movable probes that can be dynamically positioned to different test points on different dice. The third and fourth probes are specifically designed to be movable relative to each other, allowing the system to adapt to variations in test point pitch, position, or dimension while maintaining simultaneous testing capability.
2Productivity
If multiple probes are used to test multiple dice simultaneously, then throughput increases, but device complexity increases
Solution Approach 1:
The patent creates a universal testing system where the same probe structure and positioning mechanism can test multiple dice with different configurations. The fixed separation distance between probes corresponds to predetermined test points on various dice, and the movable probes can adapt to different pitch and position requirements, making the system universally applicable to multiple die configurations.
Solution Approach 2:
The patent divides the testing system into modular components: a stable base structure with fixed probes for consistent positioning, and movable probes for flexible adaptation. This segmentation allows the complex positioning task to be distributed across multiple independent but coordinated probe units, each handling specific testing functions.
3Manufacturing precision
If fixed probe positions are used, then positioning precision is improved, but adaptability to different die configurations is reduced
Solution Approach 1:
The patent combines fixed and movable elements in the probe system. The first and second probes are adjustable to fixed positions with fixed separation distances for precision, while the third and fourth probes are movable relative to each other for adaptability. This dynamic configuration allows the system to maintain precision for standard configurations while adapting to variations in test point pitch, position, or dimension.
Solution Approach 2:
The patent enables parameter changes in the probe system by allowing the third and fourth probes to change their relative positions dynamically. This allows the system to adjust to different test point configurations on different dice while the first and second probes maintain their fixed positions for consistent reference measurements.
Data Source
AI summary
A die tester comprising a testing table on which a plurality of dice arranged in an array are mountable, and a first probe and a second probe that are adjustable to a fixed position with a fixed separation distance between the first probe and the second probe. The fixed position corresponds to predetermined test points on the plurality of dice, and the testing table and the first and second probes are movable relative to each other so as to position test points of a first die of the plurality of dice to the first probe and the second probe for testing the first die. The die tester further comprises movable third and fourth probes that are movable relative to each other and positionable to test points on a second die of the plurality of dice for testing the second die.