Integrated Die Thermal Pathway for Lower Junction Temperature
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Solution Overview
Problem
Integrated device dies face issues with heat generation, which affects reliability, operating range, and performance, leading to limitations in modulation order, data rate, coverage, and battery life due to inadequate thermal resistance and junction temperature management.
Innovation Solution
The integration of a substrate with a heat generating electronic component, a dielectric layer, and a thermally conductive structure that forms a thermal pathway between the component and a terminal, with the terminal being laterally offset and electrically connected, facilitates improved heat dissipation through a heatsink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If heat generating electronic components are integrated in higher densities to increase functionality, then device performance and data rate improve, but junction temperature increases and thermal resistance worsens
Solution Approach 1:
The patent segments the thermal management function by separating the electrical connection terminal from the thermal connection terminal. The electrical terminal is laterally offset from the heat generating component, while the thermal pathway extends directly beneath the component through the dielectric layer to a thermal ground. This segmentation allows independent optimization of electrical and thermal pathways, enabling higher component density without compromising thermal performance.
Solution Approach 2:
The dielectric layer serves as an intermediary structure that simultaneously provides electrical isolation and thermal conduction. By forming a thermal pathway through the dielectric layer using thermally conductive material, the patent creates a mediator that conducts heat away from the component while maintaining electrical isolation between the electrical terminal and the thermal management system.
2Temperature
If the terminal is positioned directly under the heat generating component for optimal thermal contact, then thermal resistance improves, but electrical isolation is compromised
Solution Approach 1:
The patent divides the terminal structure into two separate terminals: an electrical terminal that provides electrical connection and is laterally offset from the heat generating component, and a thermal terminal that provides thermal sinking and is positioned beneath the component. This segmentation resolves the conflict between electrical isolation and thermal contact by assigning these functions to separate structures.
Solution Approach 2:
The dielectric layer performs multiple functions simultaneously: it provides electrical isolation between the heat generating component and underlying structures, while also serving as a medium for thermal conduction when equipped with the thermal pathway. This multi-functionality allows the same structural element to address both electrical and thermal requirements.
3Reliability
If thicker dielectric layers are used to improve electrical isolation, then electrical reliability improves, but thermal resistance increases
Solution Approach 1:
The patent applies local quality by creating a thermal pathway with enhanced thermal conductivity specifically in the region where heat needs to be conducted, while the rest of the dielectric layer maintains its electrical isolation properties. The thermal pathway is formed using thermally conductive material that is localized beneath the heat generating component, providing high thermal conductivity where needed without compromising the overall electrical isolation provided by the dielectric layer.
Solution Approach 2:
The patent uses composite material structure by combining the dielectric layer with a thermal pathway made of thermally conductive material. This composite structure integrates materials with different properties: the dielectric material provides electrical isolation, while the thermally conductive material within the thermal pathway provides heat conduction. This composite approach resolves the contradiction between electrical isolation and thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances thermal resistance and reduces junction temperature, thereby mitigating performance degradation and extending the operating range of integrated device dies.
Implementation Method 1
a thermally conductive structure formed with the dielectric layer and positioned between the substrate and the terminal... The substrate and the thermally conductive structure at least partially defines a thermal pathway between the heat generating electronic component and the terminal
Data Source
AI summary
An integrated device die is disclosed. The integrated device die can include a substrate having a first side and a second side opposite the first side, a heat generating electronic component disposed over the first side of the substrate, a dielectric layer disposed such that the heat generating electronic component is positioned at least partially between the substrate and the dielectric layer. A surface of the dielectric layer that faces away from the substrate includes a terminal that is electrically connected to the heat generating electronic component and is laterally offset from the heat generating electronic component. The thermally conductive structure is positioned between the substrate and the terminal. The substrate and the thermally conductive structure at least partially define a thermal pathway between the heat generating electronic component and the terminal.