Semiconductor Package Structure With Die-Through Region for Power Integrity
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Solution Overview
Problem
Existing semiconductor packages face challenges in improving power integrity (PI) characteristics, which affect the reliable transmission of voltage to dies mounted on circuit boards without adding noise.
Innovation Solution
The semiconductor package design includes a circuit board with specific wiring regions, die mounting regions, and underfill placement regions, along with wiring balls and die balls, to enhance PI characteristics. The package features a die with unit chips, including passive elements like decoupling capacitors, and a die-through region that exposes wiring balls to improve power transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wiring balls are densely arranged to improve electrical connection, then power transmission efficiency is improved, but impedance increases and noise is generated
Solution Approach 1:
The die is divided into multiple unit chips arranged in an array, with each unit chip having its own wiring balls. This segmentation allows the wiring balls to be distributed across multiple smaller units rather than concentrated in one area, reducing local impedance while maintaining overall power transmission reliability
Solution Approach 2:
A die-through region is introduced as an intermediary structure that exposes wiring balls from upper layers to lower layers. This allows electrical connections to be established through multiple pathways, reducing impedance by providing alternative current routes and minimizing noise through distributed connection points
2Reliability
If decoupling capacitors are added to improve power integrity, then voltage stability is improved, but device complexity increases
Solution Approach 1:
Multiple unit chips including decoupling capacitors are integrated into a single die structure. The decoupling capacitors are merged with the active circuitry at the unit chip level, providing power integrity benefits without requiring separate dedicated capacitor components or additional external elements
Solution Approach 2:
The die-through region creates a vertical dimension for electrical connections, allowing wiring balls to be exposed and connected across multiple layers. This three-dimensional arrangement enables compact integration of power delivery networks with reduced planar footprint, maintaining low complexity while improving power integrity
Data Source
AI summary
A semiconductor package including a circuit board including a first wiring region, a die mounting region surrounding the first wiring region, and a second wiring region surrounding the die mounting region; a plurality of wiring balls on the first wiring region and the second wiring region and spaced apart from one another, the plurality of wiring balls including a plurality of first wiring balls on the first wiring region and a plurality of second wiring balls on the second wiring region; a die on the die mounting region, the die including a plurality of unit chips spaced apart from one another, and a die-through region corresponding to the first wiring region and exposing the first wiring balls; and a plurality of die balls on the die and the die mounting region, the plurality of die balls being spaced apart from one another and electrically coupled to the circuit board.